| Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging CJ Hang, CQ Wang, M Mayer, YH Tian, Y Zhou, HH Wang Microelectronics reliability 48 (3), 416-424, 2008 | 318 | 2008 |
| One-step fabrication of stretchable copper nanowire conductors by a fast photonic sintering technique and its application in wearable devices S Ding, J Jiu, Y Gao, Y Tian, T Araki, T Sugahara, S Nagao, M Nogi, ... ACS applied materials & interfaces 8 (9), 6190-6199, 2016 | 181 | 2016 |
| The mechanisms of resistance spot welding of magnesium to steel L Liu, L Xiao, JC Feng, YH Tian, SQ Zhou, Y Zhou Metallurgical and Materials Transactions A 41, 2651-2661, 2010 | 117 | 2010 |
| Influence of aging treatment on deformation behavior of 96.5 Sn3. 5Ag lead-free solder alloy during in situ tensile tests Y Ding, C Wang, Y Tian, M Li Journal of Alloys and Compounds 428 (1-2), 274-285, 2007 | 114 | 2007 |
| Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5 Cu solder joints under extreme temperature thermal shock R Tian, C Hang, Y Tian, L Zhao Materials Science and Engineering: A 709, 125-133, 2018 | 105 | 2018 |
| Formation mechanism and orientation of Cu3Sn grains in Cu–Sn intermetallic compound joints R Zhang, Y Tian, C Hang, B Liu, C Wang Materials letters 110, 137-140, 2013 | 88 | 2013 |
| Highly stable flexible transparent electrode via rapid electrodeposition coating of Ag-Au alloy on copper nanowires for bifunctional electrochromic and supercapacitor device H Zhang, Y Tian, S Wang, Y Huang, J Wen, C Hang, Z Zheng, C Wang Chemical Engineering Journal 399, 125075, 2020 | 81 | 2020 |
| Nanometer-scale heterogeneous interfacial sapphire wafer bonding for enabling plasmonic-enhanced nanofluidic mid-infrared spectroscopy J Xu, Z Ren, B Dong, X Liu, C Wang, Y Tian, C Lee ACS nano 14 (9), 12159-12172, 2020 | 81 | 2020 |
| Phase transformation and grain orientation of Cu–Sn intermetallic compounds during low temperature bonding process C Hang, Y Tian, R Zhang, D Yang Journal of Materials Science: Materials in Electronics 24, 3905-3913, 2013 | 81 | 2013 |
| Effects of bump size on deformation and fracture behavior of Sn3. 0Ag0. 5Cu/Cu solder joints during shear testing Y Tian, C Hang, C Wang, S Yang, P Lin Materials Science and Engineering: A 529, 468-478, 2011 | 80 | 2011 |
| Sintering mechanism of the Cu–Ag core–shell nanoparticle paste at low temperature in ambient air Y Tian, Z Jiang, C Wang, S Ding, J Wen, Z Liu, C Wang Rsc Advances 6 (94), 91783-91790, 2016 | 79 | 2016 |
| Relationship between morphologies and orientations of Cu6Sn5 grains in Sn3. 0Ag0. 5Cu solder joints on different Cu pads Y Tian, R Zhang, C Hang, L Niu, C Wang Materials characterization 88, 58-68, 2014 | 78 | 2014 |
| Investigation of ultrasonic copper wire wedge bonding on Au/Ni plated Cu substrates at ambient temperature Y Tian, C Wang, I Lum, M Mayer, JP Jung, Y Zhou journal of materials processing technology 208 (1-3), 179-186, 2008 | 71 | 2008 |
| JIS Z 3198 无铅钎料试验方法简介与评述 王春青， 李明雨， 田艳红， 孔令超 电子工艺技术 25 (002), 47-54, 2004 | 70 | 2004 |
| Finite element modeling of electron beam welding of a large complex Al alloy structure by parallel computations Y Tian, C Wang, D Zhu, Y Zhou Journal of materials processing technology 199 (1-3), 41-48, 2008 | 69 | 2008 |
| Mechanisms for low-temperature direct bonding of Si/Si and quartz/quartz via VUV/O 3 activation J Xu, C Wang, T Wang, Y Wang, Q Kang, Y Liu, Y Tian RSC advances 8 (21), 11528-11535, 2018 | 67 | 2018 |
| Fast fabrication of copper nanowire transparent electrodes by a high intensity pulsed light sintering technique in air S Ding, J Jiu, Y Tian, T Sugahara, S Nagao, K Suganuma Physical Chemistry Chemical Physics 17 (46), 31110-31116, 2015 | 63 | 2015 |
| Flexible electronic systems via electrohydrodynamic jet printing: a MnSe@ rGO cathode for aqueous zinc-ion batteries S Wang, G Zeng, Q Sun, Y Feng, X Wang, X Ma, J Li, H Zhang, J Wen, ... ACS nano 17 (14), 13256-13268, 2023 | 60 | 2023 |
| Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5 Cu/Ni solder joints under extreme temperature environment R Tian, C Hang, Y Tian, J Feng Journal of Alloys and Compounds 777, 463-471, 2019 | 60 | 2019 |
| Glass-on-LiNbO3 heterostructure formed via a two-step plasma activated low-temperature direct bonding method J Xu, C Wang, Y Tian, B Wu, S Wang, H Zhang Applied Surface Science 459, 621-629, 2018 | 60 | 2018 |
