| The effects of hydrostatic pressure, temperature, and voltage duration on the electric strengths of hydrocarbon liquids KC Koo, JB Higham Journal of the Electrochemical Society 108 (6), 522, 1961 | 113 | 1961 |
| Analytical expressions for maximum transferred power in wireless power transfer systems S Kong, M Kim, K Koo, S Ahn, B Bae, J Kim 2011 IEEE international symposium on electromagnetic compatibility, 379-383, 2011 | 76 | 2011 |
| Modeling and analysis of a power distribution network in TSV-based 3-D memory IC including P/G TSVs, on-chip decoupling capacitors, and silicon substrate effects K Kim, C Hwang, K Koo, J Cho, H Kim, J Kim, J Lee, HD Lee, KW Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 2 …, 2012 | 64 | 2012 |
| A compact and wideband electromagnetic bandgap structure using a defected ground structure for power/ground noise suppression in multilayer packages and PCBs M Kim, K Koo, C Hwang, Y Shim, J Kim, J Kim IEEE Transactions on Electromagnetic Compatibility 54 (3), 689-695, 2012 | 54 | 2012 |
| Modeling and measurement of power supply noise effects on an analog-to-digital converter based on a chip-PCB hierarchical power distribution network analysis B Bae, Y Shim, K Koo, J Cho, JS Pak, J Kim IEEE transactions on electromagnetic compatibility 55 (6), 1260-1270, 2013 | 33 | 2013 |
| Fast algorithm for minimizing the number of decap in power distribution networks K Koo, GR Luevano, T Wang, S Özbayat, T Michalka, JL Drewniak IEEE Transactions on Electromagnetic Compatibility 60 (3), 725-732, 2017 | 32 | 2017 |
| Sparse emission source microscopy for rapid emission source imaging L Zhang, VV Khilkevich, X Jiao, X Li, S Toor, AU Bhobe, K Koo, ... IEEE Transactions on Electromagnetic Compatibility 59 (2), 729-738, 2017 | 31 | 2017 |
| Impact of pcb design on switching noise and emi of synchronous dc-dc buck converter K Koo, J Kim, M Kim, J Kim 2010 IEEE International Symposium on Electromagnetic Compatibility, 67-71, 2010 | 27 | 2010 |
| Vertical stepped impedance EBG (VSI-EBG) structure for wideband suppression of simultaneous switching noise in multilayer PCBs M Kim, K Koo, Y Shim, C Hwang, JS Pak, S Ahn, J Kim IEEE transactions on electromagnetic compatibility 55 (2), 307-314, 2012 | 25 | 2012 |
| Modeling of eye-diagram distortion and data-dependent jitter in meander delay lines on high-speed printed circuit boards (PCBs) based on a time-domain even-mode and odd-mode … G Kim, DG Kam, SJ Lee, J Kim, M Ha, K Koo, JS Pak, J Kim IEEE transactions on microwave theory and techniques 56 (8), 1962-1972, 2008 | 24 | 2008 |
| Quality characteristics and flavor compounds of Geumsan perilla leaves cultivated in greenhouse and field KW Hyun, KC Koo, JH Jang, JG Lee, MR Kim, JS Lee Korean J Food Preserv 11, 28-33, 2004 | 20 | 2004 |
| Through-silicon-via-based decoupling capacitor stacked chip in 3-D-ICs E Song, K Koo, JS Pak, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (9 …, 2013 | 19 | 2013 |
| Design of coupled resonators for wireless power transfer to mobile devices using magnetic field shaping W Ahn, S Jung, W Lee, S Kim, J Park, J Shin, H Kim, K Koo 2012 IEEE International Symposium on Electromagnetic Compatibility, 772-776, 2012 | 19 | 2012 |
| Vertical inductive bridge EBG (VIB-EBG) structure with size reduction and stopband enhancement for wideband SSN suppression M Kim, K Koo, J Kim, J Kim IEEE microwave and wireless components letters 22 (8), 403-405, 2012 | 18 | 2012 |
| An on-chip electromagnetic bandgap structure using an on-chip inductor and a MOS capacitor C Hwang, Y Shim, K Koo, M Kim, JS Pak, J Kim IEEE microwave and wireless components letters 21 (8), 439-441, 2011 | 16 | 2011 |
| Coupling path visualization and EMI mitigation for flyover QSFP connectors A Talebzadeh, PK Vuppunutala, K Koo, H Li, J Nadolny, Q Liu, J Li, ... IEEE Transactions on Electromagnetic Compatibility 62 (4), 1037-1044, 2019 | 15 | 2019 |
| Modeling and analysis of power supply noise imbalance on ultra high frequency differential low noise amplifiers in a system-in-package K Koo, Y Shim, C Yoon, J Kim, J Yoo, JS Pak, J Kim IEEE transactions on advanced packaging 33 (3), 602-616, 2010 | 14 | 2010 |
| Vertical noise coupling from on-chip switching-mode power supply in a mixed-signal stacked 3-D-IC K Koo, M Kim, JJ Kim, J Kim, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (3 …, 2013 | 13 | 2013 |
| Vertical noise coupling on wideband low noise amplifier from on-chip switching-mode DC-DC converter in 3D-IC K Koo, S Lee, J Kim 2011 8th Workshop on Electromagnetic Compatibility of Integrated Circuits, 35-40, 2011 | 12 | 2011 |
| Twelve-day medium pumping into tubular cell-laden scaffold using a lab-made PDMS connector VT Duong, TT Dang, JP Kim, K Kim, H Ko, CH Hwang, KI Koo Eur Cell Mater 38, 1-13, 2019 | 10 | 2019 |
Joungho KimProfessor of Electrical Engineering KAISTEmail yang diverifikasi di kaist.ac.kr
