| Electromagnetic interference shielding effectiveness of monolayer graphene SK Hong, KY Kim, TY Kim, JH Kim, SW Park, JH Kim, BJ Cho Nanotechnology 23 (45), 455704, 2012 | 243 | 2012 |
| Modeling and analysis of through-silicon via (TSV) noise coupling and suppression using a guard ring J Cho, E Song, K Yoon, JS Pak, J Kim, W Lee, T Song, K Kim, J Lee, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (2 …, 2011 | 199 | 2011 |
| PDN impedance modeling and analysis of 3D TSV IC by using proposed P/G TSV array model based on separated P/G TSV and chip-PDN models JS Pak, J Kim, J Cho, K Kim, T Song, S Ahn, J Lee, H Lee, K Park, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (2 …, 2011 | 160 | 2011 |
| Chip-package hierarchical power distribution network modeling and analysis based on a segmentation method J Kim, W Lee, Y Shim, J Shim, K Kim, JS Pak, J Kim IEEE Transactions on advanced packaging 33 (3), 647-659, 2010 | 125 | 2010 |
| Measurement and analysis of a high-speed TSV channel H Kim, J Cho, M Kim, K Kim, J Lee, H Lee, K Park, K Choi, HC Bae, J Kim, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 2 …, 2012 | 73 | 2012 |
| Modeling and analysis of a power distribution network in TSV-based 3-D memory IC including P/G TSVs, on-chip decoupling capacitors, and silicon substrate effects K Kim, C Hwang, K Koo, J Cho, H Kim, J Kim, J Lee, HD Lee, KW Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 2 …, 2012 | 64 | 2012 |
| Interposer power distribution network (PDN) modeling using a segmentation method for 3-D ICs with TSVs K Kim, JM Yook, J Kim, H Kim, J Lee, K Park, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 3 …, 2013 | 49 | 2013 |
| Signal and power integrity analysis in 2.5 D integrated circuits (ICs) with glass, silicon and organic interposer Y Kim, J Cho, K Kim, V Sundaram, R Tummala, J Kim 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 738-743, 2015 | 37 | 2015 |
| A wideband on-interposer passive equalizer design for chip-to-chip 30-Gb/s serial data transmission H Kim, J Cho, J Kim, S Choi, K Kim, J Lee, K Park, JS Pak, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (1 …, 2014 | 28 | 2014 |
| Power distribution network design and optimization based on frequency dependent target impedance Y Kim, K Kim, J Cho, J Kim, K Kang, T Yang, Y Ra, W Paik 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2015 | 27 | 2015 |
| Measurement and analysis of glass interposer power distribution network resonance effects on a high-speed through glass via channel Y Kim, J Cho, JJ Kim, K Kim, K Cho, S Kim, S Sitaraman, V Sundaram, ... IEEE Transactions on Electromagnetic Compatibility 58 (6), 1747-1759, 2016 | 25 | 2016 |
| Analysis of power distribution network in TSV-based 3D-IC K Kim, W Lee, J Kim, T Song, J Kim, JS Pak, J Kim, H Lee, Y Kwon, K Park 19th Topical Meeting on Electrical Performance of Electronic Packaging and …, 2010 | 22 | 2010 |
| Signal integrity analysis of silicon/glass/organic interposers for 2.5 D/3D interconnects S Choi, H Kim, K Kim, J Park, DH Jung, J Kim 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2139-2144, 2017 | 18 | 2017 |
| Analysis of power distribution network in glass, silicon interposer and PCB Y Kim, K Kim, J Cho, J Kim, V Sundaram, R Tummala 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2014 | 18 | 2014 |
| Hydraulic performance characteristics of a submersible axial-flow pump with different angles of inlet guide vane YS Kim, HS Shim, KY Kim The KSFM Journal of Fluid Machinery 21 (1), 34-40, 2018 | 14 | 2018 |
| Quantifying radiation and physics from edge-coupled signal connectors X Tian, MS Halligan, L Gui, X Li, K Kim, S Connor, B Archambeault, ... IEEE Transactions on Electromagnetic Compatibility 57 (4), 780-787, 2015 | 12 | 2015 |
| Effects of on-chip decoupling capacitors and silicon substrate on power distribution networks in TSV-based 3D-ICs K Kim, JS Pak, H Lee, J Kim 2012 IEEE 62nd Electronic Components and Technology Conference, 690-697, 2012 | 12 | 2012 |
| Modeling electromagnetic radiation at high-density PCB/connector interfaces X Tian, M Halligan, X Li, K Kim, HC Chen, S Connor, B Archambeault, ... 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC), 97-102, 2014 | 11 | 2014 |
| A compact on-interposer passive equalizer for chip-to-chip high-speed data transmission H Kim, J Cho, J Kim, K Kim, S Choi, J Kim, JS Pak 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging …, 2012 | 10 | 2012 |
| Analysis and solution for RF interference caused by PMIC noise in mobile platforms K Kim, H Shim, C Hwang IEEE Transactions on Electromagnetic Compatibility 62 (3), 682-690, 2019 | 9 | 2019 |
