A 5.4 mW/0.07 mm 2.4 GHz Front-End Receiver in 90 nm CMOS for IEEE 802.15.4 WPAN Standard M Camus, B Butaye, L Garcia, M Sie, B Pellat, T Parra
IEEE Journal of Solid-State Circuits 43 (6), 1372-1383, 2008
82 2008 Noise in AlGaAs/InGaAs/GaAs pseudomorphic HEMTs from 10 Hz to 18 GHz R Plana, L Escotte, O Llopis, H Amine, T Parra, M Gayral, J Graffeuil
IEEE transactions on electron devices 40 (5), 852-858, 1993
67 1993 Dielectric microwave characterization of the SU-8 thick resin used in an above IC process A Ghannam, C Viallon, D Bourrier, T Parra
2009 European Microwave Conference (EuMC), 1041-1044, 2009
66 2009 An improved method for the wave propagation constant γ estimation in broadband uniform millimeter‐wave transmission line JA Reynoso‐Hernández, CF Estrada‐Maldonado, T Parra, K Grenier, ...
Microwave and Optical Technology Letters 22 (4), 268-271, 1999
63 1999 Design of an original K-band active balun with improved broadband balanced behavior C Viallon, D Venturin, J Graffeuil, T Parra
IEEE microwave and wireless components letters 15 (4), 280-282, 2005
56 2005 Transimpedance amplifier-based full low-frequency noise characterization setup for Si/SiGe HBTs L Bary, M Borgarino, R Plana, T Parra, SJ Kovacic, H Lafontaine, ...
IEEE Transactions on Electron Devices 48 (4), 767-773, 2001
41 2001 A 5.4mW 0.07mm2 2.4GHz Front-End Receiver in 90nm CMOS for IEEE 802.15.4 WPAN M Camus, B Butaye, L Garcia, M Sie, B Pellat, T Parra
2008 IEEE International Solid-State Circuits Conference-Digest of Technical …, 2008
38 2008 Design and realization of high Q millimeter-wave structures through micromachining techniques B Guillon, D Cros, P Pons, K Grenier, T Parra, JL Cazaux, JC Lalaurie, ...
1999 IEEE MTT-S International Microwave Symposium Digest (Cat. No. 99CH36282 …, 1999
37 1999 CPS structure potentialities for MMICs: a CPS/CPW transition and a bias network D Prieto, JC Cayrout, JL Cazaux, T Parra, J Graffeuil
1998 IEEE MTT-S International Microwave Symposium Digest (Cat. No. 98CH36192 …, 1998
37 1998 A dedicated micromachining technology for high-aspect-ratio millimetre-wave circuits E Saint-Etienne, P Pons, G Blasquez, P Temple, V Conedera, M Dilhan, ...
Sensors and Actuators A: Physical 68 (1-3), 435-441, 1998
26 1998 A fully-integrated SOI CMOS complex-impedance detector for matching network tuning in LTE power amplifier D Nicolas, A Serhan, A Giry, T Parra, E Mercier
2017 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 15-18, 2017
25 2017 NMOS device optimization for the design of a W-band double-balanced resistive mixer C Viallon, G Ménéghin, T Parra
IEEE Microwave and Wireless Components Letters 24 (9), 637-639, 2014
22 2014 A protection circuit for HBT RF power amplifier under load mismatch conditions W Karoui, T Parra
2008 Joint 6th International IEEE Northeast Workshop on Circuits and Systems …, 2008
21 2008 High quality factor and high self-resonant frequency monolithic inductor for millimeter-wave Si-based IC's D Dubuc, E Tournier, I Telliez, T Parra, C Boulanger, J Graffeuil
2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No. 02CH37278 …, 2002
19 2002 On the effects of hot carriers on the RF characteristics of Si/SiGe heterojunction bipolar transistors M Borgarino, JG Tartarin, J Kuchenbecker, T Parra, H Lafontaine, ...
IEEE microwave and guided wave letters 10 (11), 466-468, 2000
18 2000 An original SiGe active differential output power splitter for millimetre-wave applications C Viallon, E Tournier, J Graffeuil, T Parra
2003 33rd European Microwave Conference, 1-4, 2003
16 2003 X-band low phase distortion MMIC power limiter T Parra, JM Dienot, M Gayral, M Pouysegur, JF Sautereau, J Graffeuil
IEEE transactions on microwave theory and techniques 41 (5), 876-879, 1993
14 1993 Comparative study of microwave surface impedance of high Tc superconductor samples O Llopis, T Parra, JC Ousset, DB Chrisey, JS Horwitz, J Graffeuil
Solid state communications 78 (7), 631-633, 1991
14 1991 SOI CMOS tunable capacitors for RF antenna aperture tuning D Nicolas, A Giry, EB Abdallah, S Bories, G Tant, T Parra, C Delaveaud, ...
2014 21st IEEE International Conference on Electronics, Circuits and Systems …, 2014
12 2014 3-D multilayer copper interconnects for high-performance monolithic devices and passives A Ghannam, D Bourrier, L Ourak, C Viallon, T Parra
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (6 …, 2013
12 2013