Profil

Profil

Profil saya Koleksiku

Taek-Soo Kim

Professor of Mechanical Engineering, KAIST

Email yang diverifikasi di kaist.ac.kr

Dirujuk 14729 kali

Thin Films Mechanical Properties Adhesion Microelectronics Packaging Warpage

Gary H. Bernstein

Department of Electrical Engineering, University of Notre Dame

Email yang diverifikasi di nd.edu

Dirujuk 14353 kali

Nanofabrication Microelectronics Packaging Nanomagnetics Electron Beam Lithography

Ilyas Mohammed

Founder, Innoor

Email yang diverifikasi di innoor.com

Dirujuk 8599 kali

microelectronics packaging structural thermal and fluidic analysis FEA/CFD product design

Cian O'Mathuna

Tyndall National Institute & University College Cork & Ireland

Email yang diverifikasi di Tyndall.ie

Dirujuk 7572 kali

magnetics energy harvesting microsystems microelectronics packaging system integration

Xinjun Sheng

Shanghai Jiao Tong University

Email yang diverifikasi di sjtu.edu.cn

Dirujuk 5288 kali

Biomechatronics Biorobotics Microelectronics Packaging

Chong Leong, Gan., Ph.D, FRSC, FInstP, FIOM3, FIET

Micron Memory Taiwan Co Ltd

Email yang diverifikasi di broadcom.com

Dirujuk 4176 kali

Microelectronics Packaging Reliability Engineering Device Reliability Material Science

Seung Wook Yoon, Ph.D MBA

Samsung Electronics Corp.

Dirujuk 3669 kali

Microelectronics Packaging Assembly & Packaging Wafer Level Packaging. 2.5D/3D … Reliability

Dhruv Bhate

Associate Professor, Arizona State University

Email yang diverifikasi di asu.edu

Dirujuk 1876 kali

Bio-inspired Design Architected Materials Additive Manufacturing Microelectronics Packaging

Andrew T. Barfknecht

Broadcom

Email yang diverifikasi di broadcom.com

Dirujuk 1682 kali

MEMS microelectronics packaging

Thomas Vervust

IMEC, Universiteit Gent, CMST

Email yang diverifikasi di elis.ugent.be

Dirujuk 1644 kali

Microelectronics packaging stretchable electronics smart textiles

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