| 3D printing electronic components and circuits with conductive thermoplastic filament PF Flowers, C Reyes, S Ye, MJ Kim, BJ Wiley Additive Manufacturing 18, 156-163, 2017 | 382 | 2017 |
| One-Dimensional Metal Nanostructures: From Colloidal Syntheses to Applications D Huo, MJ Kim, Z Lyu, Y Shi, BJ Wiley, Y Xia Chemical reviews 119 (15), 8972-9073, 2019 | 291 | 2019 |
| Electrochemical CO2 reduction to CO on dendritic Ag–Cu electrocatalysts prepared by electrodeposition J Choi, MJ Kim, SH Ahn, I Choi, JH Jang, YS Ham, JJ Kim, SK Kim Chemical Engineering Journal 299, 37-44, 2016 | 174 | 2016 |
| Electrodeposited Ag catalysts for the electrochemical reduction of CO2 to CO YS Ham, S Choe, MJ Kim, T Lim, SK Kim, JJ Kim Applied Catalysis B: Environmental 208, 35-43, 2017 | 157 | 2017 |
| Effect of morphology on the electrical resistivity of silver nanostructure films IE Stewart, MJ Kim, BJ Wiley ACS applied materials & interfaces 9 (2), 1870-1876, 2017 | 122 | 2017 |
| One-step Electrodeposition of Copper on Conductive 3D Printed Objects MJ Kim, MA Cruz, S Ye, AL Gray, GL Smith, N Lazarus, CJ Walker, ... Additive Manufacturing 27, 318-326, 2019 | 112 | 2019 |
| Alkaline Water Electrolysis at 25 A cm− 2 with a Microfibrous Flow‐through Electrode F Yang, MJ Kim, M Brown, BJ Wiley Advanced Energy Materials 10, 2001174, 2020 | 104 | 2020 |
| Single-crystal electrochemistry reveals why metal nanowires grow MJ Kim, S Alvarez, Z Chen, KA Fichthorn, BJ Wiley Journal of the American Chemical Society 140 (44), 14740-14746, 2018 | 97 | 2018 |
| Multigram synthesis of Cu‐Ag Core–shell nanowires enables the production of a highly conductive polymer filament for 3D printing electronics MA Cruz, S Ye, MJ Kim, C Reyes, F Yang, PF Flowers, BJ Wiley Particle & Particle Systems Characterization 35 (5), 1700385, 2018 | 94 | 2018 |
| Impact of Surface Hydrophilicity on Electrochemical Water Splitting BK Kim, MJ Kim, JJ Kim ACS Applied Materials & Interfaces 13 (10), 11940-11947, 2021 | 87 | 2021 |
| Ethylenediamine promotes Cu nanowire growth by inhibiting oxidation of Cu (111) MJ Kim, PF Flowers, IE Stewart, S Ye, S Baek, JJ Kim, BJ Wiley Journal of the American Chemical Society 139 (1), 277-284, 2017 | 82 | 2017 |
| Galvanostatic bottom-up filling of TSV-like trenches: Choline-based leveler containing two quaternary ammoniums MJ Kim, Y Seo, HC Kim, Y Lee, S Choe, YG Kim, SK Cho, JJ Kim Electrochimica Acta 163, 174-181, 2015 | 66 | 2015 |
| Modulating the Active Sites of Nickel Phosphorous by Pulse-Reverse Electrodeposition for Improving Electrochemical Water Splitting BK Kim, MJ Kim, JJ Kim Applied Catalysis B: Environmental 308, 121226, 2022 | 64 | 2022 |
| Cu bottom-up filling for through silicon vias with growing surface established by the modulation of leveler and suppressor MJ Kim, HC Kim, S Choe, JY Cho, D Lee, I Jung, WS Cho, JJ Kim Journal of the Electrochemical Society 160 (12), D3221, 2013 | 61 | 2013 |
| Modulating the growth rate, aspect ratio, and yield of copper nanowires with alkylamines MJ Kim, S Alvarez, T Yan, V Tadepalli, KA Fichthorn, BJ Wiley Chemistry of Materials 30 (8), 2809-2818, 2018 | 60 | 2018 |
| Degradation of bis (3-sulfopropyl) disulfide and its influence on copper electrodeposition for feature filling S Choe, MJ Kim, HC Kim, SK Cho, SH Ahn, SK Kim, JJ Kim Journal of The Electrochemical Society 160 (12), D3179, 2013 | 58 | 2013 |
| Selective Electroplating for 3D‐Printed Electronics N Lazarus, SS Bedair, SH Hawasli, MJ Kim, BJ Wiley, GL Smith Advanced Materials Technologies 4, 1900126, 2019 | 57 | 2019 |
| Characteristics of pulse-reverse electrodeposited Cu thin films: I. effects of the anodic step in the absence of an organic additive MJ Kim, T Lim, KJ Park, SK Cho, SK Kim, JJ Kim Journal of The Electrochemical Society 159 (9), D538, 2012 | 49 | 2012 |
| The influences of iodide ion on Cu electrodeposition and TSV filling MJ Kim, HC Kim, JJ Kim Journal of The Electrochemical Society 163 (8), D434-D441, 2016 | 48 | 2016 |
| MSA as a supporting electrolyte in copper electroplating for filling of damascene trenches and through silicon vias SK Cho, MJ Kim, JJ Kim Electrochemical and Solid-State Letters 14 (5), D52, 2011 | 43 | 2011 |
