| Temperature prediction of rolling tires by computer simulation YJ Lin, SJ Hwang Mathematics and Computers in Simulation 67 (3), 235-249, 2004 | 196 | 2004 |
| Experimental investigation of infrared rapid surface heating for injection molding PC Chang, SJ Hwang Journal of Applied Polymer Science 102 (4), 3704-3713, 2006 | 140 | 2006 |
| Simulation of infrared rapid surface heating for injection molding PC Chang, SJ Hwang International Journal of Heat and Mass Transfer 49 (21-22), 3846-3854, 2006 | 110 | 2006 |
| The influence of Cr-based coating on the adhesion force between epoxy molding compounds and IC encapsulation mold SM Chiu, SJ Hwang, CW Chu, D Gan Thin Solid Films 515 (1), 285-292, 2006 | 81 | 2006 |
| Three-dimensional modeling of mold filling in microelectronics encapsulation process RY Chang, WH Yang, SJ Hwang, F Su IEEE Transactions on Components and Packaging Technologies 27 (1), 200-209, 2004 | 76 | 2004 |
| Warpage prediction and experiments of fan-out waferlevel package during encapsulation process SS Deng, SJ Hwang, HH Lee IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (3 …, 2013 | 75 | 2013 |
| Process optimization for directed energy deposition of SS316L components PY Lin, FC Shen, KT Wu, SJ Hwang, HH Lee The International Journal of Advanced Manufacturing Technology 111, 1387-1400, 2020 | 72 | 2020 |
| Enhanced hydrogen storage properties of MgH2 co-catalyzed with zirconium oxide and single-walled carbon nanotubes SJ Hwang, YS Chuang Journal of Alloys and Compounds 664, 284-290, 2016 | 49 | 2016 |
| PVTC equation for epoxy molding compound SJ Hwang, YS Chang IEEE Transactions on components and packaging technologies 29 (1), 112-117, 2006 | 49 | 2006 |
| Study of warpage due to PVTC relation of EMC in IC packaging LC Hong, SJ Hwang IEEE Transactions on Components and Packaging Technologies 27 (2), 291-295, 2004 | 47 | 2004 |
| Method and apparatus for rapid prototyping using computer-printer aided to object realization WH Lai, CI Cheng, SY Lee, MR Wang, CS Wang, CY Chen, CL Chen, ... US Patent App. 11/093,078, 2005 | 46 | 2005 |
| Modeling a working coil coupled with magnetic flux concentrators for barrel induction heating in an injection molding machine HT Bui, SJ Hwang International Journal of Heat and Mass Transfer 86, 16-30, 2015 | 43 | 2015 |
| Development of an external-type microinjection molding module for thermoplastic polymer PC Chang, SJ Hwang, HH Lee, DY Huang Journal of Materials Processing Technology 184 (1-3), 163-172, 2007 | 43 | 2007 |
| Temperature prediction for system in package assembly during the reflow soldering process SS Deng, SJ Hwang, HH Lee International Journal of Heat and Mass Transfer 98, 1-9, 2016 | 36 | 2016 |
| Study of PVTC relation of EMC YS Chang, SJ Hwang, HH Lee, DY Huang J. Electron. Packag. 124 (4), 371-373, 2002 | 36 | 2002 |
| On a porous medium combustor for hydrogen flame stabilization and operation SS Su, SJ Hwang, WH Lai International journal of hydrogen energy 39 (36), 21307-21316, 2014 | 33 | 2014 |
| Simulations and experiments of three-dimensional paddle shift for IC packaging SY Teng, SJ Hwang Microelectronic Engineering 85 (1), 115-125, 2008 | 31 | 2008 |
| Synthesis and hydrogen absorption/desorption properties of Mg–Nb2O5-SWCNT/MWCNT nanocomposite prepared by reactive milling YS Chuang, SJ Hwang Journal of Alloys and Compounds 656, 835-842, 2016 | 30 | 2016 |
| Modeling of viscoelastic behavior of an epoxy molding compound during and after curing YJ Lin, SJ Hwang, HH Lee, DY Huang IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011 | 30 | 2011 |
| Optimization process parameters and adaptive quality monitoring injection molding process for materials with different viscosity CW Su, WJ Su, FJ Cheng, GY Liou, SJ Hwang, HS Peng, HY Chu Polymer Testing 109, 107526, 2022 | 28 | 2022 |
