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Coauteurs
- Cory BerklandWashington University in Saint LouisAdresse e-mail validée de wustl.edu
- Frances ArnoldProfessor of chemical engineering, CaltechAdresse e-mail validée de cheme.caltech.edu
- Richard D. BraatzEdwin R. Gilliland Professor, Massachusetts Institute of TechnologyAdresse e-mail validée de mit.edu
- M. Laird ForrestUniversity of KansasAdresse e-mail validée de ku.edu
- Robert LangerMassachusetts Institute of TechnologyAdresse e-mail validée de mit.edu
- Chi Hwa WangProfessor of Chemical and Biomolecular Engineering, National University of SingaporeAdresse e-mail validée de nus.edu.sg
- Deborah LeckbandUniversity of Illinois at Urbana-ChampaignAdresse e-mail validée de illinois.edu
- Koon Gee NeohChemical and Biomolecular Engineering, National University of Singapore (NUS)Adresse e-mail validée de nus.edu.sg
- Rahul K KeswaniSenior Director, Formulation DevelopmentAdresse e-mail validée de vervetx.com
- Suzie Hwang PunWashington Research Foundation Professor of Bioengineering, University of WashingtonAdresse e-mail validée de uw.edu
- Ashlee N. Ford VersyptAssociate Professor, Department of Chemical & Biological Engineering, University at Buffalo, SUNYAdresse e-mail validée de buffalo.edu
- Yujie XiaSenior Scientist, ModernaAdresse e-mail validée de modernatx.com
- James T. KoerberPrincipal Scientist, Dept. of Antibody Engineering, GenentechAdresse e-mail validée de gene.com
- Balaji NarasimhanIowa State University; Rutgers University; MIT; Purdue UniversityAdresse e-mail validée de iastate.edu
- John George HardySenior Lecturer (Associate Professor) in Materials Chemistry, Lancaster UniversityAdresse e-mail validée de lancaster.ac.uk
Suivre
Daniel W Pack
Professor, Chemical & Materials Engineering and Pharmaceutical Sciences, University of Kentucky
Adresse e-mail validée de uky.edu