Samuel Graham

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Bernard KippelenJoseph M. Pettit Professor of Electrical and Computer EngineeringAdresse e-mail validée de gatech.edu
Hossein SojoudiUniversity of ToledoAdresse e-mail validée de utoledo.edu
Baratunde ColaGeorgia Institute of Technology and Carbice CorporationAdresse e-mail validée de gatech.edu
Canek Fuentes-HernandezAssociate ProfessorAdresse e-mail validée de northeastern.edu
Seth MarderUniversity of Colorado-Boulder and National Renewable Energy LaboratoryAdresse e-mail validée de colorado.edu
Thomas BeechemPurdue UniversityAdresse e-mail validée de purdue.edu
Adam ChristensenGAMS Development Corp.Adresse e-mail validée de gams.com
William P. KingRalph A. Andersen Endowed Chair, Department of Mechanical Science and Engineering, University ofAdresse e-mail validée de illinois.edu
Hyung Chul KimGeorgia Institute of TechnologyAdresse e-mail validée de intel.com
Anthony J GiordanoGeorgia Institute of Technology Adresse e-mail validée de gatech.edu
Antoine KahnPrinceton UniversityAdresse e-mail validée de princeton.edu
Amir DindarApple Inc., PhD, Georgia Institute of TechnologyAdresse e-mail validée de apple.com
Jean-Luc BredasThe University of ArizonaAdresse e-mail validée de email.arizona.edu
Joseph J BerryNational renewable energy laboratory, Renewable Sustainable Energy Institute & Department of PhysicsAdresse e-mail validée de nrel.gov
Anuradha BulusuGeorgia Institute of TechnologyAdresse e-mail validée de me.gatech.edu
Parisa Pour Shahid Saeed AbadiAssistant Professor of Mechanical Engineering, Michigan TechAdresse e-mail validée de mtu.edu
Roderick JacksonNational Renewable Energy LaboratoryAdresse e-mail validée de nrel.gov
Minseok HaIntel CorporationAdresse e-mail validée de intel.com
Julia GreerCalifornia Institute of TechnologyAdresse e-mail validée de caltech.edu
Benoit DomercqAGC Glass CompanyAdresse e-mail validée de eu.agc.com

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Samuel Graham

University of Maryland

Adresse e-mail validée de umd.edu - Page d'accueil

thermal science electronics energy systems reliability


Titre Trier par citations Trier par année Trier par titre	Citée par Citée par	Année
A universal method to produce low–work function electrodes for organic electronics Y Zhou, C Fuentes-Hernandez, J Shim, J Meyer, AJ Giordano, H Li, ... Science 336 (6079), 327-332, 2012	2277	2012
Ultrawide‐bandgap semiconductors: research opportunities and challenges JY Tsao, S Chowdhury, MA Hollis, D Jena, NM Johnson, KA Jones, ... Advanced Electronic Materials 4 (1), 1600501, 2018	1343	2018
Thermal effects in packaging high power light emitting diode arrays A Christensen, S Graham Applied thermal engineering 29 (2-3), 364-371, 2009	404	2009
β-Gallium oxide power electronics AJ Green, J Speck, G Xing, P Moens, F Allerstam, K Gumaelius, T Neyer, ... Apl Materials 10 (2), 2022	321	2022
Electrical, thermal, and mechanical characterization of silicon microcantilever heaters J Lee, T Beechem, TL Wright, BA Nelson, S Graham, WP King Journal of Microelectromechanical Systems 15 (6), 1644-1655, 2006	280	2006
Highly tunable molecular sieving and adsorption properties of mixed-linker zeolitic imidazolate frameworks K Eum, KC Jayachandrababu, F Rashidi, K Zhang, J Leisen, S Graham, ... Journal of the American Chemical Society 137 (12), 4191-4197, 2015	232	2015
Controlled doping of large-area trilayer MoS2 with molecular reductants and oxidants. A Tarasov, S Zhang, MY Tsai, PM Campbell, S Graham, S Barlow, ... Advanced Materials (Deerfield Beach, Fla.) 27 (7), 1175-1181, 2015	231	2015
Stability of doped transparent carbon nanotube electrodes R Jackson, B Domercq, R Jain, B Kippelen, S Graham Advanced Functional Materials 18 (17), 2548-2554, 2008	226	2008
Invited Article: Simultaneous mapping of temperature and stress in microdevices using micro-Raman spectroscopy T Beechem, S Graham, SP Kearney, LM Phinney, JR Serrano Review of Scientific Instruments 78 (6), 2007	207	2007
Development of a thermal resistance model for chip-on-board packaging of high power LED arrays M Ha, S Graham Microelectronics Reliability 52 (5), 836-844, 2012	178	2012
Interfacial thermal conductance across room-temperature-bonded GaN/diamond interfaces for GaN-on-diamond devices Z Cheng, F Mu, L Yates, T Suga, S Graham ACS applied materials & interfaces 12 (7), 8376-8384, 2020	168	2020
Void growth in 6061-aluminum alloy under triaxial stress state H Agarwal, AM Gokhale, S Graham, MF Horstemeyer Materials Science and Engineering: A 341 (1-2), 35-42, 2003	164	2003
Elastomer–polymer semiconductor blends for high-performance stretchable charge transport networks D Choi, H Kim, N Persson, PH Chu, M Chang, JH Kang, S Graham, ... Chemistry of Materials 28 (4), 1196-1204, 2016	154	2016
Influence of interfacial mixing on thermal boundary conductance across a chromium/silicon interface PE Hopkins, PM Norris, RJ Stevens, TE Beechem, S Graham	154	2008
Solution-based electrical doping of semiconducting polymer films over a limited depth VA Kolesov, C Fuentes-Hernandez, WF Chou, N Aizawa, FA Larrain, ... Nature Materials 16 (4), 474-480, 2017	152	2017
Review of stability and thermal conductivity enhancements for salt hydrates N Kumar, J Hirschey, TJ LaClair, KR Gluesenkamp, S Graham Journal of Energy Storage 24, 100794, 2019	147	2019
A practical extension of the 3ω method to multilayer structures BW Olson, S Graham, K Chen Review of Scientific Instruments 76 (5), 2005	147	2005
Experimental observation of high intrinsic thermal conductivity of AlN Z Cheng, YR Koh, A Mamun, J Shi, T Bai, K Huynh, L Yates, Z Liu, R Li, ... Physical Review Materials 4 (4), 044602, 2020	144	2020
Thermal analysis of near-isothermal compressed gas energy storage system A Odukomaiya, A Abu-Heiba, KR Gluesenkamp, O Abdelaziz, ... Applied energy 179, 948-960, 2016	144	2016
Low thermal boundary resistance interfaces for GaN-on-diamond devices L Yates, J Anderson, X Gu, C Lee, T Bai, M Mecklenburg, T Aoki, ... ACS applied materials & interfaces 10 (28), 24302-24309, 2018	137	2018

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