Profils

Hiromichi Ohta

RIES, Hokkaido University

Adresse e-mail validée de es.hokudai.ac.jp

Cité 56214 fois

Thermal management Thermoelectric materials Oxides Thin Films Materials Science

Yuan Yang

Columbia University, MIT, Stanford

Adresse e-mail validée de columbia.edu

Cité 38359 fois

Batteries Energy storage Thermal Management

Ronggui Yang 杨荣贵

Peking University, Huazhong University of Science and Technology, Univ Colorado Boulder …

Adresse e-mail validée de pku.edu.cn

Cité 37938 fois

Thermal Sciences Heat Transfer Phase-Change Heat Transfer Thermal Storage Thermal Management

Eric Pop

Pease-Ye Professor of Electrical Engineering, MSE, AP at Stanford & SLAC

Adresse e-mail validée de stanford.edu

Cité 37639 fois

nanoelectronics semiconductors electron devices 2D materials thermal management

Jian-Bin XU (许建斌, JB XU)

Chinese University of Hong Kong (CUHK); Shenzhen Institute of Advanced Technology …

Adresse e-mail validée de ee.cuhk.edu.hk

Cité 31917 fois

nanotechnology nanoelectronics photonics nanomaterials thermal management

HM Ali, Ph.D. (Lond.), CEng, FIMechE, FHEA

King Fahd Univeristy of Petroleum and Minerals

Adresse e-mail validée de kfupm.edu.sa

Cité 26980 fois

Thermofluids Condensation Nanofluids Heat Transfer Devices Thermal Management

Cheng-Te Lin (林正得)

Professor (Full), Ningbo Institute of Material Tech. and Eng., Chinese Academy of Sciences

Adresse e-mail validée de nimte.ac.cn

Cité 20732 fois

Graphene-Based Biosensors Thermal Interface Materials Thermal Management

Xiangfan XU

Center for Phononics and Thermal Energy Science, Tongji University

Adresse e-mail validée de tongji.edu.cn

Cité 19716 fois

nanoscale heat transfer phononics thermal management condensed matter physics

Yuying Yan

Professor of Thermofluids Engineering, University of Nottingham, UK

Adresse e-mail validée de nottingham.ac.uk

Cité 18937 fois

Thermofluids Enhanced heat transfer Thermal management Biomimetics Heat pipes

Madhusudan K Iyengar

Google

Adresse e-mail validée de google.com

Cité 17427 fois

computer architecture thermal management data centers packaging energy efficiency

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