Md Ishak Khan

Md Ishak Khan

Packaging R&D Engineer, Intel Corporation
Adresse e-mail validée de intel.com
Cité 1033 fois
Mechanical Engineering Materials Science Substrate Packaging
Shivasubramanian Balasubramanian

Shivasubramanian Balasubramanian

University of South Carolina, Intel Corporation
Adresse e-mail validée de intel.com
Cité 959 fois
Substrate packaging PCB Polymer Composites Polymer Nanocomposites Dielectric Breakdown
Pratyush Mishra

Pratyush Mishra

Packaging R&D Engineer at Intel Corporation
Adresse e-mail validée de intel.com
Cité 218 fois
Electroplating Substrate Packaging Electrochemistry Material Science Surface Plasma Treatment