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Design and fabrication of a double-axicon for generation of tailorable self-imaged three-dimensional intensity voids BPS Ahluwalia, WC Cheong, XC Yuan, LS Zhang, SH Tao, J Bu, H Wang Optics letters 31 (7), 987-989, 2006 | 96 | 2006 |
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High-throughput multiple dies-to-wafer bonding technology and III/V-on-Si hybrid lasers for heterogeneous integration of optoelectronic integrated circuits X Luo, Y Cao, J Song, X Hu, Y Cheng, C Li, C Liu, TY Liow, M Yu, H Wang, ... Frontiers in Materials 2, 28, 2015 | 63 | 2015 |