مقاله‌های دارای تعهدات انتشار عمومی - Ryan Loweبیشتر بدانید
جای دیگری دردسترس نیست: ۹
Measurement and prediction of interface crack growth at the PCB-epoxy interfaces under high-G mechanical shock
P Lall, K Dornala, J Deep, R Lowe
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018
تعهدات: US National Science Foundation
Development of FE Models and Measurement of Internal Deformations of Fuze Electronics Using X-Ray MicroCT Data with Digital Volume Correlation
P Lall, N Kothari, J Deep, J Foley, R Lowe
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 497-506, 2017
تعهدات: US National Science Foundation
Experimental evaluation of blast loadings on the ear and head with and without hearing protection devices
TJ Walilko, RD Lowe, TF Argo, GD Meegan, NT Greene, DJ Tollin
Mechanics of Biological Systems and Materials, Volume 6: Proceedings of the …, 2017
تعهدات: US Department of Defense
Trauma care decision support under fire
C Nemeth, B Pickering, A Amos-Binks, A Harrison, Y Pinevich, R Lowe, ...
2019 IEEE International Conference on Systems, Man and Cybernetics (SMC …, 2019
تعهدات: US Department of Defense
Effect of Dielectric Material on the Reliability of 3640 MLCC Capacitors under High-G Shock Loads
P Lall, K Dornala, J Suhling, J Deep, R Lowe
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
تعهدات: US National Science Foundation
Cohesive Zone Modeling and Damage Prediction of Interfacial Delamination in Potted Electronics Subjected to High-G Mechanical Shock
P Lall, K Dornala, J Suhling, J Deep, R Lowe
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
تعهدات: US National Science Foundation
Explicit FE Failure Prediction of Interfaces and Interconnect in Potted Electronics Assemblies Subject to High-g Acceleration Loads
P Lall, K Dornala, R Lowe, J Deep
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1366-1376, 2019
تعهدات: US National Science Foundation
Analysis of progressive damage in fuze electronics using micro-computed tomography and finite element models
P Lall, N Kothari, J Deep, R Lowe
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018
تعهدات: US National Science Foundation
Effectiveness of potting methods and underfills on the enhancement of survivability of fine pitch electronics at 25,000 g shock loads
P Lall, K Dornala, J Deep, R Lowe
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017
تعهدات: US National Science Foundation
جای دیگری دردسترس است: ۷
Survivability assessment of electronics subjected to mechanical shocks up to 25,000 g
P Lall, K Dornala, R Lowe, J Foley
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
تعهدات: US National Science Foundation
Effect of drop angle variation and restraint mechanisms on surface mount electronics under high G shock
P Lall, ARR Pandurangan, VKR Dornala, J Suhling, J Deep, R Lowe
International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019
تعهدات: US National Science Foundation
Effect of shock pulse variation on surface mount electronics under high-g shock
P Lall, ARR Pandurangan, K Dornala, J Suhling, J Deep, R Lowe
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
تعهدات: US National Science Foundation
Fatigue delamination crack growth of potting compounds in PCB/Epoxy interfaces under flexure loading
P Lall, K Dornala, J Suhling, J Deep, R Lowe
International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019
تعهدات: US National Science Foundation
A novel Micro-CT data based Finite Element Modeling technique to study reliability of densely packed fuze assemblies
P Lall, N Kothari, J Foley, J Deep, R Lowe
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
تعهدات: US National Science Foundation
Life Prediction and RUL Assessment of Fine Pitch Solder Joint Fuze Electronics Under Mechanical Shock Loads Up to 50,000 g
P Lall, K Dornala, J Suhling, R Lowe, J Foley
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 232-243, 2016
تعهدات: US National Science Foundation
Assessment of reliability of missile fuze using micro-CT data based finite element technique with digital volume correlation
P Lall, N Kothari, J Deep, R Lowe
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017
تعهدات: US Department of Defense
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