| Congestion aware, fault tolerant, and thermally efficient inter-layer communication scheme for hybrid NoC-bus 3D architectures AM Rahmani, K Latif, KR Vaddina, P Liljeberg, J Plosila, H Tenhunen Proceedings of the Fifth ACM/IEEE International Symposium on Networks-on …, 2011 | 82 | 2011 |
| High-performance and fault-tolerant 3D NoC-bus hybrid architecture using ARB-NET-based adaptive monitoring platform AM Rahmani, KR Vaddina, K Latif, P Liljeberg, J Plosila, H Tenhunen IEEE Transactions on Computers 63 (3), 734-747, 2012 | 49 | 2012 |
| Design and management of high-performance, reliable and thermal-aware 3D networks-on-chip AM Rahmani, KR Vaddina, K Latif, P Liljeberg, J Plosila, H Tenhunen IET circuits, devices & systems 6 (5), 308-321, 2012 | 41 | 2012 |
| Generic monitoring and management infrastructure for 3D NoC-bus hybrid architectures AM Rahmani, KR Vaddina, K Latif, P Liljeberg, J Plosila, H Tenhunen 2012 IEEE/ACM Sixth International Symposium on Networks-on-Chip, 177-184, 2012 | 20 | 2012 |
| ARB-NET: A novel adaptive monitoring platform for stacked mesh 3D NoC architectures AM Rahmani, K Latif, KR Vaddina, P Liljeberg, J Plosila, H Tenhunen 17th Asia and South Pacific Design Automation Conference, 413-418, 2012 | 18 | 2012 |
| Thermal modeling and analysis of advanced 3D stacked structures KR Vaddina, AM Rahmani, K Latif, P Liljeberg, J Plosila Procedia Engineering 30, 248-257, 2012 | 16 | 2012 |
| Enhancing performance of noc-based architectures using heuristic virtual-channel sharing approach K Latif, AM Rahmani, KR Vaddina, T Seceleanu, P Liljeberg, H Tenhunen 2011 IEEE 35th Annual Computer Software and Applications Conference, 442-447, 2011 | 10 | 2011 |
| Self-timed thermal sensing and monitoring of multicore systems KR Vaddina, E Nigussie, P Liljeberg, J Plosila 2009 12th International Symposium on Design and Diagnostics of Electronic …, 2009 | 9 | 2009 |
| Enhancing performance sustainability of fault tolerant routing algorithms in NoC-based architectures K Latif, AM Rahmani, KR Vaddina, T Seceleanu, P Liljeberg, H Tenhunen 2011 14th Euromicro Conference on Digital System Design, 626-633, 2011 | 8 | 2011 |
| Power and area optimization of 3d networks-on-chip using smart and efficient vertical channels AM Rahmani, KR Vaddina, P Liljeberg, J Plosila, H Tenhunen Integrated Circuit and System Design. Power and Timing Modeling …, 2011 | 8 | 2011 |
| On-line distributed thermal sensing and monitoring of multicore systems KR Vaddina, L Guang, E Nigussie, P Liljeberg, J Plosila 2008 NORCHIP, 89-93, 2008 | 7 | 2008 |
| Experimental energy profiling of energy-critical embedded applications KR Vaddina, F Brandner, G Memmi, P Jouvelot 2017 25th International Conference on Software, Telecommunications and …, 2017 | 6 | 2017 |
| Power and thermal analysis of stacked mesh 3D NoC using AdaptiveXYZ routing algorithm AM Rahmani, KR Vaddina, P Liljeberg, J Plosila, H Tenhunen 2012 15th Euromicro Conference on Digital System Design, 208-215, 2012 | 6 | 2012 |
| Thermal analysis of advanced 3d stacked systems KR Vaddina, AM Rahmani, K Latif, P Liljeberg, J Plosila 2011 IEEE Computer Society Annual Symposium on VLSI, 371-372, 2011 | 6 | 2011 |
| Thermal modelling of 3D multicore systems in a flip-chip package KR Vaddina, T Mitra, P Liljeberg, J Plosila 23rd IEEE International SOC Conference, 379-383, 2010 | 5 | 2010 |
| Transient temperature prediction for aging thermal sensors using artificial neural network KR Vaddina, JM Cebrián, L Natvig 2016 24th Euromicro International Conference on Parallel, Distributed, and …, 2016 | 4 | 2016 |
| ELL-i: An inexpensive platform for fixed things P Nikander, VK Rao, P Liuha, H Tenhunen Scalable Computing: Practice and Experience 14 (3), 155-168, 2013 | 4 | 2013 |
| Experimental workflow for energy and temperature profiling on HPC systems KR Vaddina, L Lefevre, AC Orgerie 2021 IEEE Symposium on Computers and Communications (ISCC), 1-7, 2021 | 3 | 2021 |
| Thermal analysis of job allocation and scheduling schemes for 3d stacked noc's KR Vaddina, AM Rahmani, K Latif, P Liljeberg, J Plosila 2011 14th Euromicro Conference on Digital System Design, 643-648, 2011 | 3 | 2011 |
| Power-efficient inter-layer communication architectures for 3d noc AM Rahmani, K Latif, KR Vaddina, P Liljeberg, J Plosila, H Tenhunen 2011 IEEE Computer Society Annual Symposium on VLSI, 355-356, 2011 | 3 | 2011 |
Pasi LiljebergProfessor in Health Technology, University of Turku, Finlandایمیل تأیید شده در utu.fi
