| Momentum: Power-neutral performance scaling with intrinsic mppt for energy harvesting computing systems D Balsamo, BJ Fletcher, AS Weddell, G Karatziolas, BM Al-Hashimi, ... ACM Transactions on Embedded Computing Systems (TECS) 17 (6), 1-25, 2019 | 25 | 2019 |
| Power neutral performance scaling for energy harvesting MP-SoCs BJ Fletcher, D Balsamo, GV Merrett Design, Automation & Test in Europe Conference & Exhibition (DATE), 2017 …, 2017 | 21 | 2017 |
| Design and optimization of inductive-coupling links for 3-D-ICs BJ Fletcher, S Das, T Mak IEEE Transactions on Very Large Scale Integration (VLSI) Systems 27 (3), 711-723, 2018 | 18 | 2018 |
| A High-Speed Design Methodology for Inductive Coupling Links in 3D-ICs BJ Fletcher, S Das, T Mak Design, Automation & Test in Europe Conference & Exhibition (DATE), 2018 …, 2017 | 8 | 2017 |
| Globally wireless locally wired (GloWiLoW): A clock distribution network for many-core systems Q Ding, BJ Fletcher, T Mak 2018 IEEE International Symposium on Circuits and Systems (ISCAS), 1-5, 2018 | 6 | 2018 |
| CoDAPT: A concurrent data and power transceiver for fully wireless 3D-ICs BJ Fletcher, S Das, T Mak 2019 Design, Automation & Test in Europe Conference & Exhibition (DATE …, 2019 | 4 | 2019 |
| Low-power 3D Integration using Inductive Coupling Links for Neurotechnology Applications BJ Fletcher, S Das, CS Poon, T Mak Design, Automation & Test in Europe Conference & Exhibition (DATE), 2018 …, 2018 | 4 | 2018 |
| A 3D-Stacked Cortex-M0 SoC with 20.3Gbps/mm2 7.1mW/mm2 Simultaneous Wireless Inter-Tier Data and Power Transfer BJ Fletcher, T Mak, S Das 2020 IEEE Symposium on VLSI Circuits, 1-2, 2020 | 3 | 2020 |
| A spike-latency transceiver with tunable pulse control for low-energy wireless 3-D integration BJ Fletcher, S Das, T Mak IEEE Journal of Solid-State Circuits 55 (9), 2414-2428, 2020 | 3 | 2020 |
| A 10.8 pJ/bit pulse-position inductive transceiver for low-energy wireless 3D integration BJ Fletcher, T Mak, S Das ESSCIRC 2019-IEEE 45th European Solid State Circuits Conference (ESSCIRC …, 2019 | 2 | 2019 |
| Cost-effective 3D-IC design using near-field inter-tier wireless communication BJ Fletcher University of Southampton, 2020 | 1 | 2020 |
| A low-energy inductive transceiver using spike-latency encoding for wireless 3D integration BJ Fletcher, S Das, T Mak 2019 IEEE/ACM International Symposium on Low Power Electronics and Design …, 2019 | 1 | 2019 |
| Method and apparatus for communication via inductive coupling BJ Fletcher, JE Myers, S Das, SSHU Gamage US Patent App. 18/282,899, 2024 | | 2024 |
| System-in-package architecture with wireless bus interconnect BJ Fletcher, JE Myers, S Das, TST Mak US Patent 11,366,779, 2022 | | 2022 |
| Adaptive coding for wireless communication SSHU Gamage, BJ Fletcher, S Das US Patent 10,771,187, 2020 | | 2020 |
| Cost-effective 3D integration using inductive coupling links: Can we make stacking silicon as easy as stacking Lego? B Fletcher, S Das, T Mak | | 2018 |
| Power-neutral performance scaling for self-powered multicore computing systems D Balsamo, B Fletcher, G Merrett Adaptive Many-Core Architectures and Systems Workshop, 2018 | | 2018 |
| Data-set supporting the article entitled" Power Neutral Performance Scaling with Intrinsic MPPT for Energy Harvesting Computing Systems" D Balsamo, B Fletcher, A Weddell, G Karatziolas, B Al-Hashimi, G Merrett University of Southampton, 2018 | | 2018 |
| Dataset supporting the paper entitled “Low-Power 3D Integration using Inductive Coupling Links for Neurotechnology Applications B Fletcher, S Das, CS Poon, T Mak University of Southampton, 2017 | | 2017 |
| Dataset supporting the paper entitled “A High-Speed Design Methodology for Inductive Coupling Links in 3D-ICs” B Fletcher, S Das, T Mak University of Southampton, 2017 | | 2017 |
Dr Terrence MakUniversity of SouthamptonDirección de correo verificada de ecs.soton.ac.uk