Professor Robert Kay

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Marc DesmulliezHeriot-Watt University, School of Engineering & Physical Sciences, Edinburgh EH14 4ASDirección de correo verificada de hw.ac.uk
Russell HarrisProfessorDirección de correo verificada de mmu.ac.uk
Matthew Peter ShuttleworthUniversity of LeedsDirección de correo verificada de leeds.ac.uk
Jonathan D ShephardProfessor, Heriot-Watt UniversityDirección de correo verificada de hw.ac.uk
Thomas WasleyDoctoral Researcher, Loughborough UniversityDirección de correo verificada de lboro.ac.uk
Colm ConnaughtonProfessor, Warwick Mathematics Institute and Warwick Centre for Complexity Science, University ofDirección de correo verificada de warwick.ac.uk
Patrick J SmithUniversity of Sheffield, University of Freiburg, Technical University of Eindhoven, University ofDirección de correo verificada de sheffield.ac.uk
Jonathan StringerUniversity of AucklandDirección de correo verificada de auckland.ac.nz
Van Duong TADepartment of Optical Devices, Le Quy Don Technical UniversityDirección de correo verificada de lqdtu.edu.vn
Assel RyspayevaPhD in Electrical EngineeringDirección de correo verificada de imenco.com
Jose Marques-HuesoUniversity of Valencia, SpainDirección de correo verificada de uv.es
Reza Nekouie EsfahaniManufacturing Technology Centre (MTC)Dirección de correo verificada de the-mtc.org
Chris BaileyArizona State UniversityDirección de correo verificada de asu.edu
Dr T.D.A. JonesUniversity of DundeeDirección de correo verificada de dundee.ac.uk
Stoyan StoyanovProfessor in Computational Engineering, University of Greenwich, London, UKDirección de correo verificada de gre.ac.uk
Nathan WilkinsonTTP, The Technology PartnershipDirección de correo verificada de ttp.com
David FlynnProfessor , University of GlasgowDirección de correo verificada de Glasgow.ac.uk
Rajkumar DurairajDirección de correo verificada de utar.edu.my
Prof Ndy EkereEmeritus Professor & former PVC Faculty Engineering and Technology, Liverpool John Moores UniversityDirección de correo verificada de ljmu.ac.uk
Mayur K PatelUniversity of GreenwichDirección de correo verificada de gre.ac.uk

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Professor Robert Kay

University of Leeds

Dirección de correo verificada de leeds.ac.uk - Página principal

3D Printing Additive Manufacturing Hybrid Manufacturing Ceramic 3D Printing 3D Printed Electronics


Título Ordenar por citas Ordenar por año Ordenar por título	Citado por Citado por	Año
A review of aerosol jet printing—a non-traditional hybrid process for micro-manufacturing NJ Wilkinson, MAA Smith, RW Kay, RA Harris The International Journal of Advanced Manufacturing Technology 105, 4599-4619, 2019	452	2019
Nanosecond laser textured superhydrophobic metallic surfaces and their chemical sensing applications DV Ta, A Dunn, TJ Wasley, RW Kay, J Stringer, PJ Smith, C Connaughton, ... Applied Surface Science 357, 248-254, 2015	397	2015
Laser textured superhydrophobic surfaces and their applications for homogeneous spot deposition A Dunn, TJ Wasley, J Li, RW Kay, J Stringer, PJ Smith, E Esenturk, ... Applied Surface Science 365, 153-159, 2016	332	2016
Multifunctional metal matrix composites with embedded printed electrical materials fabricated by ultrasonic additive manufacturing J Li, T Monaghan, TT Nguyen, RW Kay, RJ Friel, RA Harris Composites Part B: Engineering 113, 342-354, 2017	120	2017
Laser textured surface gradients A Dunn, TJ Wasley, J Li, RW Kay, J Stringer, PJ Smith, E Esenturk, ... Applied Surface Science 371, 583-589, 2016	115	2016
Hybrid additive manufacturing of 3D electronic systems J Li, T Wasley, TT Nguyen, VD Ta, JD Shephard, J Stringer, P Smith, ... Journal of Micromechanics and Microengineering 26 (10), 105005, 2016	77	2016
A review of stencil printing for microelectronic packaging R Kay, M Desmulliez Soldering & Surface Mount Technology 24 (1), 38-50, 2012	69	2012
A rapid photopatterning method for selective plating of 2D and 3D microcircuitry on polyetherimide J Marques‐Hueso, TDA Jones, DE Watson, A Ryspayeva, MN Esfahani, ... Advanced Functional Materials 28 (6), 1704451, 2018	51	2018
Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality J Stringer, TM Althagathi, CW Christopher, T Van Duong, JD Shephard, ... Manufacturing Review 3, 12, 2016	50	2016
Dynamically controlled deposition of colloidal nanoparticle suspension in evaporating drops using laser radiation VD Ta, RM Carter, E Esenturk, C Connaughton, TJ Wasley, J Li, RW Kay, ... Soft Matter 12 (20), 4530-4536, 2016	47	2016
Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process RW Kay, S Stoyanov, GP Glinski, C Bailey, MPY Desmulliez IEEE Transactions on Components and packaging technologies 30 (1), 129-136, 2007	45	2007
A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications A Ryspayeva, TDA Jones, MN Esfahani, MP Shuttleworth, RA Harris, ... Microelectronic Engineering 209, 35-40, 2019	34	2019
Sub process challenges in ultra fine pitch stencil printing of type‐6 and type‐7 Pb‐free solder pastes for flip chip assembly applications GJ Jackson, MW Hendriksen, RW Kay, M Desmulliez, RK Durairaj, ... Soldering & Surface Mount Technology 17 (1), 24-32, 2005	32	2005
Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation S Costello, N Strusevich, D Flynn, RW Kay, MK Patel, C Bailey, D Price, ... Microsystem technologies 19, 783-790, 2013	31	2013
Additively manufactured heterogeneous substrates for three‐dimensional control of local permittivity J Tribe, WG Whittow, RW Kay, JC Vardaxoglou Electronics Letters 50 (10), 745-746, 2014	30	2014
Selective metallization of 3D printable thermoplastic polyurethanes A Ryspayeva, TDA Jones, SR Khan, MN Esfahani, MP Shuttleworth, ... IEEE Access 7, 104947-104955, 2019	29	2019
Electrohydrodynamic and aerosol jet printing for the copatterning of polydimethylsiloxane and graphene platelet inks NJ Wilkinson, RW Kay, RA Harris Advanced Materials Technologies 5 (6), 2000148, 2020	28	2020
Selective electroless copper deposition by using photolithographic polymer/Ag nanocomposite A Ryspayeva, TDA Jones, MN Esfahani, MP Shuttleworth, RA Harris, ... IEEE Transactions on Electron Devices 66 (4), 1843-1848, 2019	26	2019
Optimization and characterization of drop-on-demand inkjet printing process for platinum organometallic inks G Cummins, R Kay, J Terry, MPY Desmulliez, AJ Walton 2011 IEEE 13th Electronics Packaging Technology Conference, 256-261, 2011	26	2011
Direct metallisation of polyetherimide substrates by activation with different metals TDA Jones, A Ryspayeva, MN Esfahani, MP Shuttleworth, RA Harris, ... Surface and Coatings Technology 360, 285-296, 2019	25	2019

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