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Parnika Gupta
Parnika Gupta
Tyndall National Institute
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Integrated photonics packaging: challenges and opportunities
L Ranno, P Gupta, K Gradkowski, R Bernson, D Weninger, S Serna, ...
ACS Photonics 9 (11), 3467-3485, 2022
502022
High aspect ratio through-glass vias as heat conductive element
K Kröhnert, M Wöhrmann, M Schiffer, C Kelb, N Ambrosius, P Gupta, ...
2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 1-6, 2022
72022
Reference thermal chips for 2D and 3D Co-packaging process development
P Gupta, R Bernson, N Nudds, S Collins, K Gradkowski, PE Morrissey, ...
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2160-2165, 2023
42023
Design optimization of micro-thermoelectric cooler for thermal management using finite element simulations
R Kaur, A Tanwar, P Gupta, N Padmanathan, P O'Brien, KM Razeeb
2022 28th International Workshop on Thermal Investigations of ICs and …, 2022
22022
Impact of through glass vias filling on the performance of passive thermal cooling in photonic packages
P Gupta, PE Morrissey, P O'Brien, K Kröhnert, M Wöhrmann, M Schiffer, ...
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC …, 2022
22022
Packaging strategies for 3D integration of Photonic and Electronic chips on a Glass substrate
R Bernson, S Wakeel, P Gupta, L Ranno, D Weninger, A Agarwal, ...
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 804-808, 2023
12023
Gallium Nitride interconnects for quantum integrated photonic chips
P Gupta, I Novitasari
FOMO2018_Summer Poster, 0
1
Sodium silicate as an enabler for wafer bonding of glass substrates and lids
P Gupta, J O’Brien, JS Lee, HY Hwang, K Gradkowski, PE Morrissey, ...
2024
Substrate integrated micro-thermoelectric coolers in glass substrate for next-generation photonic packages
P Gupta, A Tanwar, X He, K Gradkowski, KM Razeeb, PE Morrissey, ...
Journal of Optical Microsystems 4 (1), 011006, 2024
2024
Day 1-Wednesday 10 May-Western Gateway Building-UCC
R Tummala
El sistema no puede realizar la operación en estos momentos. Inténtalo de nuevo más tarde.
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