| A review of advanced thermal management solutions and the implications for integration in high-voltage packages AC Iradukunda, DR Huitink, F Luo IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 256-271, 2019 | 84 | 2019 |
| Photoinduced formation of electrically conductive thin palladium nanowires on DNA scaffolds S Kundu, K Wang, D Huitink, H Liang Langmuir 25 (17), 10146-10152, 2009 | 77 | 2009 |
| Additive manufacturing for enhancing thermal dissipation in heat sink implementation: a review BM Nafis, R Whitt, AC Iradukunda, D Huitink Heat Transfer Engineering 42 (12), 967-984, 2021 | 76 | 2021 |
| Design, characterization, and modeling of a chitosan microneedle patch for transdermal delivery of meloxicam as a pain management strategy for use in cattle DA Castilla-Casadiego, H Carlton, D Gonzalez-Nino, KA Miranda-Muñoz, ... Materials Science and Engineering: C 118, 111544, 2021 | 71 | 2021 |
| Transient thermal performance using phase change material integrated topology optimized heat sinks AC Iradukunda, A Vargas, D Huitink, D Lohan Applied Thermal Engineering 179, 115723, 2020 | 69 | 2020 |
| A multistage, semi-automated procedure for analyzing the morphology of nanoparticles C Park, JZ Huang, D Huitink, S Kundu, BK Mallick, H Liang, Y Ding IIE transactions 44 (7), 507-522, 2012 | 54 | 2012 |
| Design and evaluation of a 150 kva sic mosfet based three level tnpc phase-leg pebb for aircraft motor driving application Z Yuan, A Deshpande, B Narayanasamy, H Peng, AI Emon, R Whitt, ... 2019 IEEE Energy Conversion Congress and Exposition (ECCE), 6569-6574, 2019 | 39 | 2019 |
| Photochemical formation of electrically conductive silver nanowires on polymer scaffolds S Kundu, D Huitink, K Wang, H Liang Journal of Colloid and interface Science 344 (2), 334-342, 2010 | 39 | 2010 |
| Formation and catalytic application of electrically conductive Pt nanowires S Kundu, D Huitink, H Liang The Journal of Physical Chemistry C 114 (17), 7700-7709, 2010 | 38 | 2010 |
| A system to package perspective on transient thermal management of electronics HP De Bock, D Huitink, P Shamberger, JS Lundh, S Choi, N Niedbalski, ... Journal of Electronic Packaging 142 (4), 041111, 2020 | 37 | 2020 |
| Thermal and electrical performance in high-voltage power modules with nonmetallic additively manufactured impingement coolers R Whitt, D Huitink, A Emon, A Deshpande, F Luo IEEE transactions on power electronics 36 (3), 3192-3199, 2020 | 34 | 2020 |
| Stacked DBC cavitied substrate for a 15-kV half-bridge power module A Deshpande, F Luo, A Iradukunda, D Huitink, L Boteler 2019 IEEE International Workshop on Integrated Power Packaging (IWIPP), 12-17, 2019 | 33 | 2019 |
| Rapid solder interconnect fatigue life test methodology for predicting thermomechanical reliability CJ Marbut, M Montazeri, DR Huitink IEEE Transactions on Device and Materials Reliability 18 (3), 412-421, 2018 | 27 | 2018 |
| Insulation and switching performance optimization for partial-discharge-free laminated busbar in more-electric aircraft applications Z Yuan, Y Wang, Z Wang, AI Emon, F Luo, D Huitink IEEE Transactions on Power Electronics 37 (6), 6831-6843, 2021 | 23 | 2021 |
| Failure mechanisms driven reliability models for power electronics: A review OE Gabriel, DR Huitink Journal of Electronic Packaging 145 (2), 020801, 2023 | 22 | 2023 |
| Tribochemistry as an alternative synthesis pathway H Carlton, D Huitink, H Liang Lubricants 8 (9), 87, 2020 | 22 | 2020 |
| Influence of crystalline polymorphism on the phase change properties of sorbitol-Au nanocomposites X Liu, C Marbut, D Huitink, G Feng, AS Fleischer Materials Today Energy 12, 379-388, 2019 | 22 | 2019 |
| Degradation of polyvinyl alcohol under mechanothermal stretching D Cristancho, Y Zhou, R Cooper, D Huitink, F Aksoy, Z Liu, H Liang, ... Journal of molecular modeling 19, 3245-3253, 2013 | 20 | 2013 |
| Nanoparticle shape evolution identified through multivariate statistics D Huitink, S Kundu, C Park, B Mallick, JZ Huang, H Liang The Journal of Physical Chemistry A 114 (17), 5596-5600, 2010 | 20 | 2010 |
| Heat transfer and pressure drop performance of additively manufactured polymer heat spreaders for low-weight directed cooling integration in power electronics R Whitt, B Nafis, D Huitink, Z Yuan, A Deshpande, B Narayanasamy, ... 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 16 | 2019 |
