Molecular dynamics study of strengthening mechanism of nanolaminated graphene/Cu composites under compression S Weng, H Ning, T Fu, N Hu, Y Zhao, C Huang, X Peng Scientific reports 8 (1), 3089, 2018 | 129 | 2018 |
Molecular dynamics simulation of effects of twin interfaces on Cu/Ni multilayers T Fu, X Peng, S Weng, Y Zhao, F Gao, L Deng, Z Wang Materials Science and Engineering: A 658, 1-7, 2016 | 65 | 2016 |
Molecular dynamics simulation of AlN thin films under nanoindentation H Xiang, H Li, T Fu, Y Zhao, C Huang, G Zhang, X Peng Ceramics International 43 (5), 4068-4075, 2017 | 53 | 2017 |
Molecular dynamics simulation of TiN (001) thin films under indentation T Fu, X Peng, Y Zhao, R Sun, S Weng, C Feng, Z Wang Ceramics International 41 (10), 14078-14086, 2015 | 51 | 2015 |
Molecular dynamics simulations for responses of nanotwinned diamond films under nanoindentation C Huang, X Peng, B Yang, Y Zhao, H Xiang, X Chen, Q Li, T Fu Ceramics International 43 (18), 16888-16894, 2017 | 49 | 2017 |
Molecular dynamics simulation of deformation twin in rocksalt vanadium nitride T Fu, X Peng, Y Zhao, T Li, Q Li, Z Wang Journal of Alloys and Compounds 675, 128-133, 2016 | 49 | 2016 |
MD simulation of nanoindentation on (001) and (111) surfaces of Ag–Ni multilayers Y Zhao, X Peng, T Fu, R Sun, C Feng, Z Wang Physica E: Low-dimensional Systems and Nanostructures 74, 481-488, 2015 | 46 | 2015 |
Strengthening mechanisms of graphene coated copper under nanoindentation Y Zhao, X Peng, T Fu, X Zhu, N Hu, C Yan Computational Materials Science 144, 42-49, 2018 | 44 | 2018 |
Molecular dynamics simulation of nano-indentation of (111) cubic boron nitride with optimized Tersoff potential Y Zhao, X Peng, T Fu, C Huang, C Feng, D Yin, Z Wang Applied Surface Science 382, 309-315, 2016 | 40 | 2016 |
Strain rate dependence of tension and compression behavior in nano-polycrystalline vanadium nitride T Fu, X Peng, C Huang, S Weng, Y Zhao, Z Wang, N Hu Ceramics International 43 (15), 11635-11641, 2017 | 39 | 2017 |
Unveiling the working mechanism of graphene bubble film/silicon composite anodes in Li-ion batteries: from experiment to modeling KC Wasalathilake, SNS Hapuarachchi, Y Zhao, JFS Fernando, H Chen, ... ACS Applied Energy Materials 3 (1), 521-531, 2019 | 38 | 2019 |
Nanoindentation of ultra-hard cBN films: a molecular dynamics study C Huang, X Peng, T Fu, Y Zhao, C Feng, Z Lin, Q Li Applied Surface Science 392, 215-224, 2017 | 38 | 2017 |
MD simulation of effect of crystal orientations and substrate temperature on growth of Cu/Ni bilayer films T Fu, X Peng, Y Zhao, C Feng, C Huang, Q Li, Z Wang Applied Physics A 122, 1-9, 2016 | 38 | 2016 |
Molecular dynamics simulation of the slip systems in VN T Fu, X Peng, Y Zhao, R Sun, D Yin, N Hu, Z Wang Rsc Advances 5 (95), 77831-77838, 2015 | 33 | 2015 |
Uncovering the mechanism of size effect on the thermomechanical properties of highly cross-linked epoxy resins Y Zhao, G Kikugawa, Y Kawagoe, K Shirasu, N Kishimoto, Y Xi, T Okabe The Journal of Physical Chemistry B 126 (13), 2593-2607, 2022 | 32 | 2022 |
Molecular-scale investigation on relationship between thermal conductivity and the structure of crosslinked epoxy resin Y Zhao, G Kikugawa, Y Kawagoe, K Shirasu, T Okabe International Journal of Heat and Mass Transfer 198, 123429, 2022 | 31 | 2022 |
Investigation of mechanical behaviour of amorphous aluminium nitride Y Zhao, X Peng, T Fu, C Huang, H Xiang, N Hu, C Yan Materialia 2, 148-156, 2018 | 31 | 2018 |
First-principles calculation and molecular dynamics simulation of fracture behavior of VN layers under uniaxial tension T Fu, X Peng, Y Zhao, C Feng, S Tang, N Hu, Z Wang Physica E: Low-dimensional Systems and Nanostructures 69, 224-231, 2015 | 24 | 2015 |
Graphene coating makes copper more resistant to plastic deformation X Zhu, Y Zhao, L Ma, G Zhang, W Ren, X Peng, N Hu, L Rintoul, JM Bell, ... Composites Communications 12, 106-111, 2019 | 23 | 2019 |
Grain size dependence of tensile properties in nanocrystalline diamond C Huang, X Peng, B Yang, S Weng, Y Zhao, T Fu Computational Materials Science 157, 67-74, 2019 | 23 | 2019 |