| Electrical Design of Through Silicon Via M Lee, J Pak, J Kim Springer, 2014 | 41 | 2014 |
| Thermal analysis for temperature robust wireless power transfer systems K Hwang, S Chung, U Yoon, M Lee, S Ahn 2013 IEEE Wireless Power Transfer (WPT), 52-55, 2013 | 28 | 2013 |
| Modeling and analysis of TSV noise coupling effects on RF LC-VCO and shielding structures in 3D IC J Lim, J Cho, DH Jung, JJ Kim, S Choi, DH Kim, M Lee, J Kim IEEE Transactions on Electromagnetic Compatibility 60 (6), 1939-1947, 2018 | 17 | 2018 |
| A novel stochastic model-based eye-diagram estimation method for 8B/10B and TMDS-encoded high-speed channels J Park, S Choi, JJ Kim, Y Kim, M Lee, H Kim, B Bae, H Song, K Cho, S Lee, ... IEEE Transactions on Electromagnetic Compatibility 60 (5), 1510-1519, 2017 | 17 | 2017 |
| Temperature-dependent through-silicon via (TSV) model and noise coupling M Lee, J Cho, J Kim, JS Pak, J Kim, H Lee, J Lee, K Park 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging …, 2011 | 13 | 2011 |
| Noise coupling of through-via in silicon and glass interposer M Lee, J Cho, J Kim, J Kim, J Kim 2013 IEEE 63rd Electronic Components and Technology Conference, 1806-1810, 2013 | 11 | 2013 |
| High-speed probe card design to reduce the crosstalk noise for wafer-level test E Lee, M Lee, JJ Kim, M Kim, J Kim, J Kim, J Park, J Park, Y Bang, I Kim 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging …, 2014 | 9 | 2014 |
| Thermal effects on through-silicon via (TSV) signal integrity M Lee, J Cho, J Kim, JS Pak, H Lee, J Lee, K Park, J Kim 2012 IEEE 62nd Electronic Components and Technology Conference, 816-821, 2012 | 9 | 2012 |
| High-Frequency Temperature-Dependent Through-Silicon Via (TSV) Model and High-Speed Channel Performance for 3D IC M Lee, D Jung, H Kim, J Cho, J Kim IEEE Design & Test 33 (2), 17-29, 2016 | 8 | 2016 |
| Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC J Lim, M Lee, DH Jung, JJ Kim, S Choi, H Lee, J Kim 2015 10th International Workshop on the Electromagnetic Compatibility of …, 2015 | 8 | 2015 |
| Noise coupling analysis between TSV and active circuit M Lee, J Cho, J Kim 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2012 | 7 | 2012 |
| Semiconductor package M Lee, E Song, KB Kim, KS Oh, ES Jang US Patent 11,862,618, 2024 | 5 | 2024 |
| Modeling, measurement, and analysis of audio frequency ground integrity for a TDMA smartphone system S Park, J Song, S Kim, Y Kim, M Lee, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (4 …, 2018 | 5 | 2018 |
| Audio frequency ground integrity modeling and measurement for a TDMA smartphone system S Park, J Song, S Kim, M Lee, J Kim, J Kim 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 3-5, 2016 | 5 | 2016 |
| Through silicon via (TSV) noise coupling effects on RF LC-VCO in 3D IC J Lim, J Cho, M Lee, DH Jung, S Choi, H Lee, J Kim, H Kim, Y Kim, Y Kim 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging …, 2014 | 5 | 2014 |
| Ground guard structure to reduce the crosstalk noise and electromagnetic interference (EMI) in a vertical probe card for wafer-level testing E Lee, M Lee, JJ Kim, M Kim, J Kim, J Kim, J Park, Y Joo, Y Bang, I Kim, ... 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2014 | 4 | 2014 |
| Novel Optimization Methodology of Design Parameters in High-Speed Differential Via for PCIe Gen5 Channels Based on Particle Swarm Optimization Algorithm C Cho, K Kim, M Lee, J Shin, S Yoon, Y Lee, C Song, W Choi, M Kwak, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | 3 | 2023 |
| Solving power integrity challenges for smart computing era M Lee, E Song, G Kim, DKS Oh 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2252-2257, 2021 | 3 | 2021 |
| Semiconductor package including a plurality of semiconductor chips M Lee, E Song, K Oh US Patent 12,057,441, 2024 | 2 | 2024 |
| Differential via optimization for PCIe Gen5 channel based on particle swarm optimization algorithm C Cho, K Kim, M Lee, J Shin, S Yoon, Y Lee, C Song, W Choi, M Kwak, ... 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging …, 2022 | 2 | 2022 |
Joungho KimProfessor of Electrical Engineering KAISTVerified email at kaist.ac.kr
