Semiconductor isolation structure with air gaps in deep trenches HS Shue, TI Yang, WD Wu, MT Chung, SC Yu US Patent 9,269,609, 2016 | 47 | 2016 |
Microelectromechanical systems (MEMS) devices at different pressures H Huang, HF Chen, WC Tai, SC Yu, CM Hung, AT Chang, BCS Chou, ... US Patent 9,656,857, 2017 | 41 | 2017 |
Fabrication of alignment layer free flexible liquid crystal cells using thermal nanoimprint lithography TC Lin, SC Yu, PS Chen, KY Chi, HC Pan, CY Chao Current Applied Physics 9 (3), 610-612, 2009 | 25 | 2009 |
Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications SC Yu, CM Hung, H Huang, HF Chen, AT Chang, WC Tai US Patent 10,131,540, 2018 | 19 | 2018 |
Microelectrochemical systems (MEMS) device having a seal layer arranged over or lining a hole in fluid communication with a cavity of the MEMS device CM Hung, SC Yu, HF Chen, WC Tai, H Huang US Patent 9,567,204, 2017 | 13 | 2017 |
High Vacuum Sealing for Sensor Platform Process CM Hung, SC Yu, HF Chen, WC Tai, H Huang US Patent App. 14/472,636, 2016 | 12 | 2016 |
Deep well process for MEMS pressure sensor SC Yu, HS Shue US Patent 8,558,330, 2013 | 12 | 2013 |
Device and method for protecting FEOL element and BEOL element PC Yeh, T Lien-Yao, SC Yu US Patent 10,155,660, 2018 | 11 | 2018 |
Monolithic MEMS platform for integrated pressure, temperature, and gas sensor SC Yu, CM Hung, H Huang, HF Chen, AT Chang, WC Tai US Patent 9,845,236, 2017 | 11 | 2017 |
Semiconductor isolation structure with air gaps in deep trenches HS Shue, TI Yang, WD Wu, MT Chung, SC Yu US Patent 10,049,941, 2018 | 9 | 2018 |
Method for sealing a cavity of a microelectromechanical systems (MEMS) device using a seal layer covering or lining a hole in fluid communication with the cavity CM Hung, SC Yu, HF Chen, WC Tai, H Huang US Patent 10,392,244, 2019 | 8 | 2019 |
Structure and method of providing a re-distribution layer (RDL) and a through-silicon via (TSV) SC Yu, CM Hung, HF Chen, WC Tai, H Huang US Patent 9,202,792, 2015 | 8 | 2015 |
Liquid assembly of floating nanomaterial sheets for transparent electronics Z Su, HSC Yu, X Zhang, J Brugger, H Zhang Advanced Materials Technologies 4 (10), 1900398, 2019 | 7 | 2019 |
Precise Capillary‐Assisted Nanoparticle Assembly in Reusable Templates HSC Yu, A Conde‐Rubio, HC Wang, OJF Martin, G Boero, J Brugger Particle & Particle Systems Characterization 39 (4), 2100288, 2022 | 4 | 2022 |
Microelectromechanical systems (MEMS) devices at different pressures H Huang, HF Chen, WC Tai, SC Yu, CM Hung, AT Chang, BCS Chou, ... US Patent 9,856,139, 2018 | 4 | 2018 |
Thin film structure for hermetic sealing SC Yu, HF Chen, H Huang, CM Hung, WC Tai US Patent 9,714,166, 2017 | 4 | 2017 |
Semiconductor arrangement and formation thereof H Huang, HF Chen, WC Tai, CM Hung, SC Yu, HH Lin, YC Hsieh US Patent 9,776,858, 2017 | 3 | 2017 |
Methods for forming a high-voltage super junction by trench and epitaxial doping TI Yang, SW Lee, SC Yu, HS Shue, KM Huang, PT Chu US Patent 9,614,031, 2017 | 1 | 2017 |
Flexible Liquid Crystal Cells without Alignment Film TC Lin, SC Yu, PS Chen, KY Chi, HC Pan, CY Chao Molecular Crystals and Liquid Crystals 510 (1), 141/[1275]-147/[1281], 2009 | 1 | 2009 |
Device for protecting feol element and beol element P Yeh, T Lien-Yao, SC Yu US Patent App. 17/827,533, 2022 | | 2022 |