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Henry Shao-Chi Yu
Henry Shao-Chi Yu
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Title
Cited by
Cited by
Year
Semiconductor isolation structure with air gaps in deep trenches
HS Shue, TI Yang, WD Wu, MT Chung, SC Yu
US Patent 9,269,609, 2016
472016
Microelectromechanical systems (MEMS) devices at different pressures
H Huang, HF Chen, WC Tai, SC Yu, CM Hung, AT Chang, BCS Chou, ...
US Patent 9,656,857, 2017
412017
Fabrication of alignment layer free flexible liquid crystal cells using thermal nanoimprint lithography
TC Lin, SC Yu, PS Chen, KY Chi, HC Pan, CY Chao
Current Applied Physics 9 (3), 610-612, 2009
252009
Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications
SC Yu, CM Hung, H Huang, HF Chen, AT Chang, WC Tai
US Patent 10,131,540, 2018
192018
Microelectrochemical systems (MEMS) device having a seal layer arranged over or lining a hole in fluid communication with a cavity of the MEMS device
CM Hung, SC Yu, HF Chen, WC Tai, H Huang
US Patent 9,567,204, 2017
132017
High Vacuum Sealing for Sensor Platform Process
CM Hung, SC Yu, HF Chen, WC Tai, H Huang
US Patent App. 14/472,636, 2016
122016
Deep well process for MEMS pressure sensor
SC Yu, HS Shue
US Patent 8,558,330, 2013
122013
Device and method for protecting FEOL element and BEOL element
PC Yeh, T Lien-Yao, SC Yu
US Patent 10,155,660, 2018
112018
Monolithic MEMS platform for integrated pressure, temperature, and gas sensor
SC Yu, CM Hung, H Huang, HF Chen, AT Chang, WC Tai
US Patent 9,845,236, 2017
112017
Semiconductor isolation structure with air gaps in deep trenches
HS Shue, TI Yang, WD Wu, MT Chung, SC Yu
US Patent 10,049,941, 2018
92018
Method for sealing a cavity of a microelectromechanical systems (MEMS) device using a seal layer covering or lining a hole in fluid communication with the cavity
CM Hung, SC Yu, HF Chen, WC Tai, H Huang
US Patent 10,392,244, 2019
82019
Structure and method of providing a re-distribution layer (RDL) and a through-silicon via (TSV)
SC Yu, CM Hung, HF Chen, WC Tai, H Huang
US Patent 9,202,792, 2015
82015
Liquid assembly of floating nanomaterial sheets for transparent electronics
Z Su, HSC Yu, X Zhang, J Brugger, H Zhang
Advanced Materials Technologies 4 (10), 1900398, 2019
72019
Precise Capillary‐Assisted Nanoparticle Assembly in Reusable Templates
HSC Yu, A Conde‐Rubio, HC Wang, OJF Martin, G Boero, J Brugger
Particle & Particle Systems Characterization 39 (4), 2100288, 2022
42022
Microelectromechanical systems (MEMS) devices at different pressures
H Huang, HF Chen, WC Tai, SC Yu, CM Hung, AT Chang, BCS Chou, ...
US Patent 9,856,139, 2018
42018
Thin film structure for hermetic sealing
SC Yu, HF Chen, H Huang, CM Hung, WC Tai
US Patent 9,714,166, 2017
42017
Semiconductor arrangement and formation thereof
H Huang, HF Chen, WC Tai, CM Hung, SC Yu, HH Lin, YC Hsieh
US Patent 9,776,858, 2017
32017
Methods for forming a high-voltage super junction by trench and epitaxial doping
TI Yang, SW Lee, SC Yu, HS Shue, KM Huang, PT Chu
US Patent 9,614,031, 2017
12017
Flexible Liquid Crystal Cells without Alignment Film
TC Lin, SC Yu, PS Chen, KY Chi, HC Pan, CY Chao
Molecular Crystals and Liquid Crystals 510 (1), 141/[1275]-147/[1281], 2009
12009
Device for protecting feol element and beol element
P Yeh, T Lien-Yao, SC Yu
US Patent App. 17/827,533, 2022
2022
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