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- James L BosseUniversity of ConnecticutVerified email at uconn.edu
- R. RAMESHUniversity of California, BerkeleyVerified email at berkeley.edu
- Yasemin KutesSr. Test R&D Engineer, Intel CorporationVerified email at intel.com
- Linghan YeBruker Corp.Verified email at uconn.edu
- Darrell G. SchlomCornell UniversityVerified email at cornell.edu
- Oleg KolosovProfessor of Nanoscience, Physics Department, Lancaster University, UKVerified email at lancaster.ac.uk
- Nitin P. PadtureOtis E. Randall University Professor, Brown UniversityVerified email at brown.edu
- Jorge Íñiguez-GonzálezLuxembourg Institute of Science and Technology (LIST)Verified email at list.lu
- Yuanyuan ZhouThe Hong Kong University of Science and Technology (HKUST)Verified email at ust.hk
- Roger H. FrenchKyocera Professor, Case Western Reserve University, Case School of Engineering, Materials ScienceVerified email at case.edu
- Varun VyasBennett University, IndiaVerified email at bennett.edu.in
- Morgan TrassinProfessor at Materials Department ETH ZurichVerified email at mat.ethz.ch
- Kristopher O. DavisUniversity of Central FloridaVerified email at ucf.edu
- Jeffrey R. McCutcheonUniversity of ConnecticutVerified email at engr.uconn.edu
- John HeronUniversity of MichiganVerified email at umich.edu
- Justin LuriaSr. Electrical Engineer, RaytheonVerified email at raytheon.com
- Jon IhlefeldUniversity of VirginiaVerified email at virginia.edu
- Andrzej J KulikEPFL SwitzerlandVerified email at epfl.ch
- Robert SzoszkiewiczUniversity of WarsawVerified email at chem.uw.edu.pl
- John BlendellPurdue UniversityVerified email at purdue.edu