| Enhancement of the thermoelectric properties of PEDOT: PSS thin films by post-treatment J Luo, D Billep, T Waechtler, T Otto, M Toader, O Gordan, E Sheremet, ... Journal of Materials Chemistry A 1 (26), 7576-7583, 2013 | 374 | 2013 |
| Highly-integrated lab-on-chip system for point-of-care multiparameter analysis S Schumacher, J Nestler, T Otto, M Wegener, E Ehrentreich-Förster, ... Lab on a Chip 12 (3), 464-473, 2012 | 198 | 2012 |
| A comprehensive review of miniatured wind energy harvesters Q Wen, X He, Z Lu, R Streiter, T Otto Nano Materials Science 3 (2), 170-185, 2021 | 119 | 2021 |
| Polypropylene-based melt mixed composites with singlewalled carbon nanotubes for thermoelectric applications: Switching from p-type to n-type by the addition of polyethylene glycol J Luo, G Cerretti, B Krause, L Zhang, T Otto, W Jenschke, M Ullrich, ... Polymer 108, 513-520, 2017 | 81 | 2017 |
| Chemical post-treatment and thermoelectric properties of poly (3, 4-ethylenedioxylthiophene): poly (styrenesulfonate) thin films J Luo, D Billep, T Blaudeck, E Sheremet, RD Rodriguez, DRT Zahn, ... Journal of Applied Physics 115 (5), 2014 | 81 | 2014 |
| Micro-metalforming with silicon dies J Böhm, A Schubert, T Otto, T Burkhardt Microsystem Technologies 7 (4), 191-195, 2001 | 70 | 2001 |
| Polymer lab-on-chip systems with integrated electrochemical pumps suitable for large-scale fabrication J Nestler, A Morschhauser, K Hiller, T Otto, S Bigot, J Auerswald, ... The International Journal of Advanced Manufacturing Technology 47, 137-145, 2010 | 41 | 2010 |
| Piezoelectric scanning micromirror with built-in sensors based on thin film aluminum nitride K Meinel, C Stoeckel, M Melzer, S Zimmermann, R Forke, K Hiller, T Otto IEEE Sensors Journal 21 (8), 9682-9689, 2020 | 30 | 2020 |
| Aluminum Patterned Electroplating from AlCl3–[EMIm]Cl Ionic Liquid towards Microsystems Application MS Al Farisi, S Hertel, M Wiemer, T Otto Micromachines 9 (11), 589, 2018 | 30 | 2018 |
| Integration of an optical ring resonator biosensor into a self-contained microfluidic cartridge with active, single-shot micropumps S Geidel, S Peransi Llopis, M Rodrigo, G de Diego-Castilla, A Sousa, ... Micromachines 7 (9), 153, 2016 | 28 | 2016 |
| Modelling and simulation for dielectric constant of aerogel X Xiao, R Streiter, G Ruan, R Song, T Otto, T Gessner Microelectronic engineering 54 (3-4), 295-301, 2000 | 25 | 2000 |
| Investigation of surface pre-treatment methods for wafer-level Cu-Cu thermo-compression bonding K Tanaka, WS Wang, M Baum, J Froemel, H Hirano, S Tanaka, M Wiemer, ... Micromachines 7 (12), 234, 2016 | 24 | 2016 |
| 2D scanning micromirror with large scan angle and monolithically integrated angle sensors based on piezoelectric thin film aluminum nitride K Meinel, M Melzer, C Stoeckel, A Shaporin, R Forke, S Zimmermann, ... Sensors 20 (22), 6599, 2020 | 21 | 2020 |
| Principle and applications of a new MOEMS spectrometer T Otto, R Saupe, A Weiss, V Stock, R Bruch, T Gessner MOEMS Display, Imaging, and Miniaturized Microsystems IV 6114, 77-86, 2006 | 18 | 2006 |
| A novel dual-detector micro-spectrometer T Otto, R Saupe, V Stock, R Bruch, B Gruska, T Gessner MOEMS and Miniaturized Systems V 5719, 76-82, 2005 | 18 | 2005 |
| Closed-form formulae for frequency-dependent 3-D interconnect inductance Z Zhu, X Xia, R Streiter, G Ruan, T Otto, H Wolf, T Gessner Microelectronic Engineering 56 (3-4), 359-370, 2001 | 17 | 2001 |
| Fabrication of micro-optical components by high-precision embossing T Otto, A Schubert, J Boehm, T Gessner Micromachining Technology for Micro-Optics 4179, 96-106, 2000 | 17 | 2000 |
| Characterisation of MOS transistors as an electromechanical transducer for stress N Hafez, S Haas, KU Loebel, D Reuter, M Ramsbeck, M Schramm, ... physica status solidi (a) 216 (19), 1700680, 2019 | 16 | 2019 |
| Integrated Microsystems for Smart Applications. T Otto, S Kurth, S Voigt, A Morschhauser, M Meinig, K Hiller, M Moebius, ... Sensors & Materials 30, 2018 | 16 | 2018 |
| Modeling and optimization of a vortex induced vibration fluid kinetic energy harvester Q Wen, R Schulze, D Billep, T Otto, T Gessner Procedia Engineering 87, 779-782, 2014 | 16 | 2014 |
