Evaluation and classification of physical and psychological stress in firefighters using heart rate variability U Pluntke, S Gerke, A Sridhar, J Weiss, B Michel 2019 41st Annual International Conference of the IEEE Engineering in …, 2019 | 68 | 2019 |
Internet of the body-Wearable monitoring and coaching T Brunschwiler, J Weiss, S Paredes, A Sridhar, U Pluntke, SM Chau, ... 2019 Global IoT Summit (GIoTS), 1-6, 2019 | 12 | 2019 |
Morphology of low-temperature all-copper interconnects formed by dip transfer L Del Carro, J Zürcher, S Gerke, T Wildsmith, G Ramos, T Brunschwiler 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 961-967, 2017 | 11 | 2017 |
Influence of post-hydrogenation upon electrical, optical and structural properties of hydrogen-less sputter-deposited amorphous silicon S Gerke, HW Becker, D Rogalla, F Singer, N Brinkmann, S Fritz, ... Thin Solid Films 598, 161-169, 2016 | 9 | 2016 |
Replacing NRA by fast GD-OES measurements as input to a model based prediction of hydrogen diffusion in a-Si J Steffens, HW Becker, S Gerke, S Joos, G Hahn, B Terheiden Energy Procedia 124, 180-187, 2017 | 7 | 2017 |
Bias-plasma assisted RF magnetron sputter deposition of hydrogen-less amorphous silicon S Gerke, G Hahn, R Job, B Terheiden Energy Procedia 84, 105-109, 2015 | 7 | 2015 |
About nuclear resonant reaction analysis for hydrogen investigations in amorphous silicon S Gerke, HW Becker, D Rogalla, G Hahn, R Job, B Terheiden Energy Procedia 84, 99-104, 2015 | 5 | 2015 |
Morphology and hydrogen in passivating amorphous silicon layers S Gerke, HW Becker, D Rogalla, G Hahn, R Job, B Terheiden Energy Procedia 77, 791-798, 2015 | 5 | 2015 |
Investigation of hydrogen dependent long-time thermal characteristics of PECV-deposited intrinsic amorphous layers of different morphologies S Gerke, HW Becker, D Rogalla, G Hahn, R Job, B Terheiden | 5 | 2014 |
Internet of the body and cognitive hypervisor R Strässle, S Gerke, T Brunschwiler, Y Temiz, J Weiss, A Sridhar, ... 2017 IEEE/ACM International Conference on Connected Health: Applications …, 2017 | 4 | 2017 |
Model based prediction of the trap limited diffusion of hydrogen in post‐hydrogenated amorphous silicon S Gerke, HW Becker, D Rogalla, R Job, B Terheiden physica status solidi (RRL)–Rapid Research Letters 10 (11), 828-832, 2016 | 4 | 2016 |
Relief printing of micron-sized electrical conductive structures on silicon S Gerke, J Zürcher, L Del Carro, X Chen, T Brunschwiler Flexible and Printed Electronics 2 (1), 014004, 2017 | 3 | 2017 |
Evaluation of capacitance-voltage spectroscopy by correlation with minority carrier lifetime measurements of PECV-deposited intrinsic amorphous layers S Gerke, A Herguth, NH Brinkmann, G Hahn, R Job | 3 | 2013 |
Optical classification for quality and defect analysis of train brakes S Glock, S Hausmann, S Gerke, A Warok, P Spiess, S Witte, V Lohweg Optical Measurement Systems for Industrial Inspection VI 7389, 623-631, 2009 | 2 | 2009 |
Internet of the body and cognitive companion: Enabling high-quality monitoring of patients at home R Straessle, Y Temiz, S Gerke, J Weiss, A Sridhar, S Paredes, ... 2017 IEEE 19th International Conference on e-Health Networking, Applications …, 2017 | 1 | 2017 |
Capacitance–voltage spectroscopy and analysis of dielectric intrinsic amorphous silicon thin films S Gerke, G Micard, R Job, G Hahn, B Terheiden physica status solidi (c) 13 (10‐12), 724-728, 2016 | 1 | 2016 |
The EU Project R2M-Si on Roll to Module Processed Crystalline Silicon Thin-Films S Lindekugel, B Terheiden, R Pavlović, K Van Nieuwenhuysen, ... Proceedings of the 29th European Photovoltaic Solar Energy Conference, 2014 | 1 | 2014 |
Circuitized substrate with electronic components mounted on transversal portion thereof TJ Brunschwiler, S Gerke, SS Oggioni US Patent 10,622,295, 2020 | | 2020 |
Circuitized substrate with electronic components mounted on transversal portion thereof TJ Brunschwiler, S Gerke, SS Oggioni US Patent 10,622,296, 2020 | | 2020 |
Stresslevelbestimmung in der Atemschutzausbildung S Gerke, U Pluntke, A Sridhar, J Weiss, B Michel BRANDSchutz 73 (03), 178-184, 2019 | | 2019 |