| Porous polyimide membranes prepared by wet phase inversion for use in low dielectric applications S Kim, KS Jang, HD Choi, SH Choi, SJ Kwon, ID Kim, JA Lim, JM Hong International Journal of Molecular Sciences 14 (5), 8698-8707, 2013 | 75 | 2013 |
| Mechanics and rheology of basalt fiber-reinforced polycarbonate composites KS Jang Polymer 147, 133-141, 2018 | 61 | 2018 |
| Electrical interconnection with a smart ACA composed of fluxing polymer and solder powder YS Eom, KS Jang, JT Moon, JD Nam ETRI Journal 32 (3), 414-421, 2010 | 60 | 2010 |
| Theoretical analysis and development of thermally conductive polymer composites SJ Kim, C Hong, KS Jang Polymer 176, 110-117, 2019 | 45 | 2019 |
| Characterization of fluxing and hybrid underfills with micro‐encapsulated catalyst for long pot life YS Eom, JH Son, KS Jang, HS Lee, HC Bae, KS Choi, HS Choi ETRI Journal 36 (3), 343-351, 2014 | 43 | 2014 |
| Mineral filler effect on the mechanics and flame retardancy of polycarbonate composites: Talc and kaolin KS Jang e-Polymers 16 (5), 379-386, 2016 | 39 | 2016 |
| Catalytic behavior of Sn/Bi metal powder in anhydride-based epoxy curing KS Jang, YS Eom, JT Moon, YS Oh, JD Nam Journal of Nanoscience and Nanotechnology 9 (12), 7461-7466, 2009 | 39 | 2009 |
| Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder YS Eom, K Jang, JT Moon, JD Nam, JM Kim Microelectronic Engineering 85 (11), 2202-2206, 2008 | 39 | 2008 |
| Chemo-rheological characteristics of a self-assembling anisotropic conductive adhesive system containing a low-melting point solder JW Baek, KS Jang, YS Eom, JT Moon, JM Kim, JD Nam Microelectronic engineering 87 (10), 1968-1972, 2010 | 37 | 2010 |
| Synchronous vapor-phase polymerization of poly (3, 4-ethylenedioxythiophene) and poly (3-hexylthiophene) copolymer systems for tunable optoelectronic properties KS Jang, DO Kim, JH Lee, SC Hong, TW Lee, Y Lee, JD Nam Organic Electronics 11 (10), 1668-1675, 2010 | 34 | 2010 |
| Collective laser‐assisted bonding process for 3D TSV integration with NCP W Alves Braganca, YS Eom, KS Jang, SH Moon, HC Bae, KS Choi Etri Journal 41 (3), 396-407, 2019 | 30 | 2019 |
| In-situ blends of polypyrrole/poly (3, 4-ethylenedioxythiopene) using vapor phase polymerization technique DO Kim, PC Lee, SJ Kang, K Jang, JH Lee, MH Cho, JD Nam Thin Solid Films 517 (14), 4156-4160, 2009 | 29 | 2009 |
| Probing the interplay of ultraviolet cross-linking and noncovalent interactions in supramolecular elastomers S Monemian, KS Jang, H Ghassemi, LSTJ Korley Macromolecules 47 (16), 5633-5642, 2014 | 28 | 2014 |
| Phlogopite-reinforced natural rubber (NR)/ethylene-propylene-diene monomer rubber (EPDM) composites with aminosilane compatibilizer SH Lee, SY Park, KH Chung, KS Jang Polymers 13 (14), 2318, 2021 | 23 | 2021 |
| Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging KS Jang, YS Eom, KS Choi, HC Bae Polymer International 67 (9), 1241-1247, 2018 | 23 | 2018 |
| Low-density polycarbonate composites with robust hollow glass microspheres by tailorable processing variables KS Jang Polymer Testing 84, 106408, 2020 | 20 | 2020 |
| Development of stacking process for 3D TSV (through silicon via) structure using laser KS Choi, WA Braganca, KS Jang, HC Bae, YS Eom International Symposium on Microelectronics 2017 (1), 000067-000071, 2017 | 20 | 2017 |
| Synchronous curable deoxidizing capability of epoxy–anhydride adhesive: Deoxidation quantification via spectroscopic analysis KS Jang, YS Eom, KS Choi, HC Bae Journal of Applied Polymer Science 135 (33), 46639, 2018 | 19 | 2018 |
| Biphenyl-based liquid crystals for elevated temperature processing with polymers KS Jang, JC Johnson, T Hegmann, E Hegmann, LSTJ Korley Liquid Crystals 41 (10), 1473-1482, 2014 | 18 | 2014 |
| Interconnection process using laser and hybrid underfill for LED array module on PET substrate KS Choi, WAB Junior, KS Jang, SH Moon, HC Bae, YS Eom, MK Cho, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1567-1573, 2018 | 17 | 2018 |