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Co-authors
- Kazuhito TsukagoshiWPI-MANA, National Institute for Materials Science (NIMS)Verified email at nims.go.jp
- Yong XuNanjing University of Posts and TelecommunicationsVerified email at njupt.edu.cn
- Mengjiao LiUniversity of Southern CaliforniaVerified email at email.nchu.edu.tw
- Songlin LiNanjing University, Jiangsu, ChinaVerified email at nju.edu.cn
- Huabin SunNanjing University of Posts and TelecommunicationsVerified email at njupt.edu.cn
- Ching-Hwa HoProf. of Grad. Inst. Appl. Sci. & Technol, National Taiwan University of Science and TechnologyVerified email at mail.ntust.edu.tw
- Ko-Chun LEEPostdoctoral researcher, National Tsing Hua University (NTHU), TaiwanVerified email at gapp.nthu.edu.tw
- Mahito YamamotoAssociate Professor, Kansai UniversityVerified email at kansai-u.ac.jp
- Po-Wen ChiuDepartment of Electrical Engineering, Nation Tsing Hua UniversityVerified email at ee.nthu.edu.tw
- Kenji WatanabeNational Institute for Materials ScienceVerified email at nims.go.jp
- Yong-Young Noh (노용영)Pohang University of Science and Technology (POSTECH)Verified email at postech.ac.kr
- Katsunori WakabayashiKwansei Gakuin University, Osaka University, National Institute for Materials Science (NIMS)Verified email at kwansei.ac.jp
- Gerard GhibaudoIMEP-LAHC, Minatec-INP GrenobleVerified email at minatec.inpg.fr
- Lain-Jong LiUniversity of Hong KongVerified email at hku.hk