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Co-authors
- Filippo GiannazzoCNR, Istituto per la Microelettronica e i Microsistemi, Catania, ItalyVerified email at imm.cnr.it
- Emanuele RiminiCNR-IMM e dipartimento Fisica university of CataniaVerified email at imm.cnr.it
- Amritesh RaiFront End Process Integration Engineer @ Intel ▪️ UT Austin ▪️ Ohio StateVerified email at utexas.edu
- Deji AkinwandeThe University of Texas at Austin, IEEE, MRS, APS, AAS FellowVerified email at ece.utexas.edu
- Emanuel TutucProfessor, The University of Texas at AustinVerified email at mer.utexas.edu
- Anupam RoyThe University of Texas at AustinVerified email at austin.utexas.edu
- Luigi ColomboUniversity of Texas at DallasVerified email at utdallas.edu
- C. ClaeysProfessor KU LeuvenVerified email at kuleuven.be
- Giuseppe CompagniniFull Professor of Physical Chemistry, University of Catania - ItalyVerified email at unict.it
- Shixuan YangUniversity of Texas at AustinVerified email at utexas.edu
- David BruncoVerified email at alum.mit.edu
- Geert HellingsimecVerified email at imec.be
- Sk Fahad ChowdhuryMicroelectronics Research Center, UT AustinVerified email at utexas.edu
- Nasibeh RahimiIntelVerified email at intel.com
- Michael E RamonThe University of Texas at AustinVerified email at utexas.edu
- Emmanuel U. Onyegam, Ph.D.University of Texas at AustinVerified email at utexas.edu
- Sayan SahaIntel CorporationVerified email at intel.com