Saranraj Karuppuswami

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Premjeet ChahalProfessor, Michigan State UniversityVerified email at msu.edu
Saikat MondalAnalog EngineerVerified email at intel.com
Mohd Ifwat Mohd GhazaliUniversity of Cambridge, Universiti Sains Islam MalaysiaVerified email at usim.edu.my
Amanpreet KaurAssistant Professor-Oakland UniversityVerified email at oakland.edu
Kanishka WijewardenaGraduate Research Assistant, Michigan State UniversityVerified email at msu.edu
Jennifer A. ByfordMIT Lincoln LaboratoryVerified email at msu.edu
Alocilja, EvangelynProfessor, Michigan State UniversityVerified email at msu.edu
Yiming DengProfessor of Electrical and Computer Engineering, Fellow of ASNT, Michigan State UniversityVerified email at egr.msu.edu
Brian L. WrightResearch/Instructional Equipment Technician II, Michigan State UniversityVerified email at egr.msu.edu
C.J. ReddyAltair, Vice President-Business Development, Electromagnetics-Americas, AltairVerified email at ieee.org
Edward RothwellEmeritus Professor of Electrical and Computer Engineering, Michigan State UniversityVerified email at egr.msu.edu
James LennonGraduate Student at Michigan State UniversityVerified email at msu.edu
Nophadon WiwatcharagosesPh.D student, ECE department, Michigan State UniversityVerified email at msu.edu
Michael HavrillaProfessor of Electrical Engineering, Air Force Institute of TechnologyVerified email at afit.edu
Yihang ChuDoctorate Student, Michigan State UniversityVerified email at msu.edu
VIJAYALAKSHMI S.RAssociate Professor in Electronics and Communication Systems, Sri Krishna college of arts and scienceVerified email at skasc.ac.in
Paul T ComanUniversity of South CarolinaVerified email at cec.sc.edu
Taylor R. GarrickElectrochemical Engineer, Battery Modeling, General MotorsVerified email at gm.com
Sean Thomas DixGeneral Motors, University of Michigan, Clemson UniversityVerified email at umich.edu
Deepak KumarResearch Assistant, Michigan State UniversityVerified email at msu.edu

Saranraj Karuppuswami

Global Technical Specialist RF/EMI/EMC, General Motors

Verified email at msu.edu

RF and microwave circuits Supply chain sensors RFID Additive Manufacturing Material


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Blockchain inspired RFID-based information architecture for food supply chain S Mondal, KP Wijewardena, S Karuppuswami, N Kriti, D Kumar, P Chahal IEEE Internet of Things Journal 6 (3), 5803-5813, 2019	340	2019
Demonstration of RF and microwave passive circuits through 3-D printing and selective metalization JA Byford, MIM Ghazali, S Karuppuswami, BL Wright, P Chahal IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (3 …, 2017	74	2017
3-D printed air substrates for the design and fabrication of RF components MIM Ghazali, S Karuppuswami, A Kaur, P Chahal IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (6 …, 2017	63	2017
RFID coupled passive digital ammonia sensor for quality control of packaged food S Karuppuswami, S Mondal, D Kumar, P Chahal IEEE Sensors Journal 20 (9), 4679-4687, 2020	45	2020
A wireless RFID compatible sensor tag using gold nanoparticle markers for pathogen detection in the liquid food supply chain S Karuppuswami, LL Matta, EC Alocilja, P Chahal IEEE sensors letters 2 (2), 1-4, 2018	42	2018
A hybrid magnetoelastic wireless sensor for detection of food adulteration S Karuppuswami, A Kaur, H Arangali, PP Chahal IEEE Sensors Journal 17 (6), 1706-1714, 2017	40	2017
Harmonic RFID communication using conventional UHF system D Kumar, S Mondal, S Karuppuswami, Y Deng, P Chahal IEEE Journal of Radio Frequency Identification 3 (4), 227-235, 2019	32	2019
Embedded actives using additive manufacturing for high-density RF circuits and systems MIM Ghazali, S Karuppuswami, S Mondal, A Kaur, P Chahal IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (8 …, 2019	32	2019
ID integrated batteryless wireless digital pH sensor S Mondal, S Karuppuswami, P Chahal IEEE Sensors Journal 19 (24), 12079-12086, 2019	26	2019
Embedded passive RF tags towards intrinsically locatable buried plastic materials MIM Ghazali, S Karuppuswami, P Chahal 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2575-2580, 2016	21	2016
3D Printed high functional density packaging compatible out-of-plane antennas MIM Ghazali, S Karuppuswami, A Kaur, P Chahal Additive Manufacturing 30, 100863, 2019	18	2019
3-D printed embedded passive harmonic sensor tag as markers for buried assets localization MIM Ghazali, S Karuppuswami, P Chahal IEEE Sensors Letters 3 (4), 1-4, 2019	18	2019
AuNP-RF sensor: An innovative application of RF technology for sensing pathogens electrically in liquids (SPEL) within the food supply chain LL Matta, S Karuppuswami, P Chahal, EC Alocilja Biosensors and Bioelectronics 111, 152-158, 2018	18	2018
3D printed out-of-plane antennas for use on high density boards MIM Ghazali, JA Byford, S Karuppuswami, A Kaur, J Lennon, P Chahal 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1835-1842, 2017	17	2017
Rfid compatible sensor tags for remote liquid sample interrogation S Karuppuswami, A Kaur, MIM Ghazali, P Chahal 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2401-2407, 2016	16	2016
A wearable passive pH sensor for health monitoring S Mondal, S Karuppuswami, R Steinhorst, P Chahal 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1240-1245, 2019	15	2019
A nonlinear transmission line based harmonic RF tag S Mondal, MIM Ghazali, S Karuppuswami, A Kaur, P Chahal 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2237-2242, 2017	15	2017
A wireless battery-less seat sensor for autonomous vehicles S Mondal, K Wijewardena, S Karrapuswami, D Kumar, P Chahal, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2289-2294, 2020	14	2020
Embedded active elements in 3D printed structures for the design of RF circuits MIM Ghazali, S Karuppuswami, S Mondal, P Chahal 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1062-1067, 2018	13	2018
Capillary condensation based wireless volatile molecular sensor S Karuppuswami, N Wiwatcharagoses, A Kaur, P Chahal 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1455-1460, 2017	13	2017

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