| Sensitivity analysis in cost-effectiveness studies: from guidelines to practice R Jain, M Grabner, E Onukwugha Pharmacoeconomics 29, 297-314, 2011 | 112 | 2011 |
| A survey of nephrologists’ views on preemptive transplantation R Jain, CD Mullins, JA Vassalotti, ST Bartlett Clinical Journal of the American Society of Nephrology 3 (6), 1837-1845, 2008 | 51 | 2008 |
| KI/K2S2O8-Mediated α-C–H Sulfenylation of Carbonyl Compounds with (Hetero) Aryl Thiols Z Yang, J Li, J Hua, T Yang, J Yi, C Zhou Synlett 28 (17), 2325-2329, 2017 | 13 | 2017 |
| Thin film barrier seed metallization in magnetic-plugged through hole inductor K Darmawikarta, S Pietambaram, S Gaan, SRS Boyapati, P Chatterjee, ... US Patent 11,443,885, 2022 | 12 | 2022 |
| Package with underfill containment barrier R Jain, KO Lee, SK Alur, WLK Jen, VV Mehta, A Dhall, SCJ Chavali, ... US Patent 11,158,558, 2021 | 12 | 2021 |
| Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate R Jain, JY Park, KO Lee US Patent 10,468,374, 2019 | 9 | 2019 |
| Large Scale Photodesmear for Via Residue Cleaning in High Density Interconnect substrates T Habu, M Namai, A Aiba, H Kikuiri, S Maruyama, H Horibe, H Suzuki, ... International Symposium on Microelectronics 2015 (1), 000465-000468, 2015 | 9 | 2015 |
| Review on powder injection molding of engineering ceramics P Rogers, R Jain Materials and Manufacturing Processes, 2014 | 8 | 2014 |
| Methods to incorporate thin film capacitor sheets (TFC-S) in the build-up films R Jain, KO Lee US Patent 11,410,921, 2022 | 6 | 2022 |
| Soldered metallic reservoirs for enhanced transient and steady-state thermal performance N Neal, NS Haehn, SC ARGUEDAS, E Cetegen, J Vehonsky, SS Cho, ... US Patent App. 16/526,087, 2021 | 6 | 2021 |
| Magnetic inductor structures for package devices P Chatterjee, J Zhao, S Vadlamani, Y Wang, R Jain, AJ Brown, LA Link, ... US Patent 11,335,632, 2022 | 5 | 2022 |
| Methods of embedding magnetic structures in substrates S Vadlamani, P Chatterjee, RA May, RS Jain, LA Link, AJ Brown, KO Lee US Patent 11,251,113, 2022 | 5 | 2022 |
| Substrate embedded heat pipe RA May, K Darmawikarta, R Jain, L May, M Moussallem, P Chatterjee US Patent App. 16/209,861, 2020 | 5 | 2020 |
| Pyridoxine responsive seizures secondary to isoniazid prophylaxis in an infant A Singh, S Nair, R Jain Neurology India 65 (Suppl 1), S94-S95, 2017 | 5 | 2017 |
| Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate R Jain, K Lee, IA Salama, AP Alur, WLK Jen, Y Min US Patent 11,581,271, 2023 | 4 | 2023 |
| Lithographically defined vertical interconnect access (via) for a bridge die first level interconnect (fli) K Darmawikarta, T Ibrahim, S Alur, R Jain, C Haobo US Patent App. 16/455,688, 2020 | 4 | 2020 |
| Nickel-tin microbump structures and method of making same R Jain, KO Lee, AE Schuckman, SS Cho US Patent App. 15/267,065, 2018 | 4 | 2018 |
| Formation of Aminosilane and Thiol Monolayers on Semiconductor Surfaces and Bulk Wet Etching of III--V Semiconductors R Jain The University of Arizona., 2012 | 4 | 2012 |
| Cavity structures in integrated circuit package supports R Jain, S Vadlamani, J Zhao, JY Park, KO Lee, C Xu US Patent 11,557,489, 2023 | 3 | 2023 |
| Coreless organic packages with embedded die and magnetic inductor structures AJ Brown, R Jain, P Chatterjee, LA Link, S Vadlamani US Patent 10,700,021, 2020 | 3 | 2020 |
