| New insights into fracture of Si in Cu-filled through silicon via during and after thermal annealing D Sonawane, P Kumar Engineering Fracture Mechanics 238, 107281, 2020 | 15 | 2020 |
| Effect of strain rate and filler size on mechanical behavior of a Cu filled elastomer based composite S Oberoi, D Sonawane, P Kumar Composites Science and Technology 127, 185-192, 2016 | 15 | 2016 |
| New insights into dewetting of Cu thin films deposited on Si D Sonawane, A Choudhury, P Kumar Langmuir 36 (20), 5534-5545, 2020 | 14 | 2020 |
| Role of grain boundary sliding in structural integrity of Cu-filled through Si via during isothermal annealing D Sonawane, P Kumar Journal of Electronic Materials 50 (3), 767-778, 2021 | 7 | 2021 |
| Stability of Cu-islands formed on Si substrate via ‘dewetting’under subsequent thermal cycling D Sonawane, P Kumar Nanotechnology 32 (19), 195703, 2021 | 7 | 2021 |
| Effect of aspect ratio of test specimens on quasistatic compression loading and stress-relaxation of PDMS and a Cu-filled-PDMS composite D Sonawane, S Oberoi, P Kumar Polymer Testing 55, 173-183, 2016 | 6 | 2016 |
| Design, manufacturing and performance analysis of spiral coil pump NR Patil, SR Gaikwad, RA Navale, DS Sonawane Applied Mechanics and Materials 446, 549-552, 2014 | 5 | 2014 |
| Mechanical reliability of photovoltaic cells under cyclic thermal loading D Sonawane, PC Ramamurthy, P Kumar Journal of Electronic Materials 49, 59-71, 2020 | 3 | 2020 |
| High Strain Rate Compressive Deformation Behavior of Nickel Microparticles B Bellón, LK Bhaskar, T Brink, R Aymerich-Armengol, D Sonawane, ... arXiv preprint arXiv:2408.07462, 2024 | 1 | 2024 |
| Effect of accelerated thermal cyclic loading on structural reliability of cu-filled TSV D Sonawane, P Kumar 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 1-5, 2019 | 1 | 2019 |
| Creep of Cu-Bi Alloys with High Bi Content Near and Above Melting Temperature of Bi SP Singh, D Sonawane, P Kumar Metallurgical and Materials Transactions A 50, 2690-2701, 2019 | 1 | 2019 |
| Filling a gap in materials mechanics: Nanoindentation at high constant strain rates upto LK Bhaskar, D Sonawane, H Holz, J Paeng, P Schweizer, J Rao, B Bellón, ... arXiv preprint arXiv:2502.06668, 2025 | | 2025 |
| 3D Printed Liquid-Filled Metal Microarchitectures SG Kang, B Bellon, LK Bhaskar, K Jeong, LS Aota, D Sonawane, K Ding, ... Available at SSRN 5006898, 2024 | | 2024 |
| High strain rate nanoindentation on a low angle grain boundary in copper H Holz, L Bhaskar, D Sonawane, G Dehm, JP Best, ... ECI Nanomechanical Testing in Materials Research and Development IX, 2024 | | 2024 |
| High Strain Rate Compressive Deformation Behavior of Nickel Microparticles B Bellón Lara, L Bhaskar, T Brink, R Aymerich Armengol, D Sonawane, ... | | 2024 |
| Exploring micro-/nano-mechanical behaviour at extreme strain rates L Bhaskar, B Bellón Lara, D Sonawane, H Holz, D Frey, L Petho, J Michler, ... TMS Annual Meeting and Exhibition 2024, 2024 | | 2024 |
| Influence of a low angle grain boundary on high strain rate deformation in copper H Holz, L Kumar Bhaskar, B Bellón, D Sonawane, G Dehm, J Best, ... # PLACEHOLDER_PARENT_METADATA_VALUE#, 2024 | | 2024 |
| Ultra-high strain rate nanoindentation and micro compression L Bhaskar, B Bellón Lara, D Sonawane, H Holz, D Frey, G Mohanty, ... FEMS Euromat, 2023 | | 2023 |
| Dynamic Testing of Iron-Aluminium Alloy Microparticles Fabricated using a Solid-State Dewetting D Sonawane, L Bhaskar, B Bellón Lara, D Chatain, M Palm, JP Best, ... FEMS EUROMAT 2023, 2023 | | 2023 |
| Dynamic Cryo-Mechanical Properties of Dewetted Nickel Microparticles B Bellón Lara, L Bhaskar, D Sonawane, R Aymerich Armengol, T Brink, ... TMS 2023 152nd Annual Meeting and Exhibition, 2023 | | 2023 |
Praveen KumarIndian Institute of Science, Bangalore, IndiaVerified email at iisc.ac.in