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Jae-Yoon Sim
Jae-Yoon Sim
Verified email at postech.ac.kr
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Cited by
Year
Atmospheric-pressure plasma sources for biomedical applications
GY Park, SJ Park, MY Choi, IG Koo, JH Byun, JW Hong, JY Sim, ...
Plasma Sources Science and Technology 21 (4), 043001, 2012
4392012
Wireless smart contact lens for diabetic diagnosis and therapy
DH Keum, SK Kim, J Koo, GH Lee, C Jeon, JW Mok, BH Mun, KJ Lee, ...
Science advances 6 (17), eaba3252, 2020
3652020
A fully-integrated 71 nW CMOS temperature sensor for low power wireless sensor nodes
S Jeong, Z Foo, Y Lee, JY Sim, D Blaauw, D Sylvester
IEEE Journal of solid-state circuits 49 (8), 1682-1693, 2014
2402014
A 1 GHz ADPLL With a 1.25 ps Minimum-Resolution Sub-Exponent TDC in 0.18m CMOS
SK Lee, YH Seo, HJ Park, JY Sim
IEEE Journal of Solid-State Circuits 45 (12), 2874-2881, 2010
2112010
A 21 fJ/conversion-step 100 kS/s 10-bit ADC with a low-noise time-domain comparator for low-power sensor interface
SK Lee, SJ Park, HJ Park, JY Sim
IEEE Journal of Solid-State Circuits 46 (3), 651-659, 2011
2092011
Biomimetic anti-reflective triboelectric nanogenerator for concurrent harvesting of solar and raindrop energies
D Yoo, SC Park, S Lee, JY Sim, I Song, D Choi, H Lim, DS Kim
Nano Energy 57, 424-431, 2019
1622019
A digital-domain calibration of split-capacitor DAC for a differential SAR ADC without additional analog circuits
JY Um, YJ Kim, EW Song, JY Sim, HJ Park
IEEE Transactions on Circuits and Systems I: Regular Papers 60 (11), 2845-2856, 2013
1342013
5.8 A 9.3 nW all-in-one bandgap voltage and current reference circuit
Y Ji, C Jeon, H Son, B Kim, HJ Park, JY Sim
2017 IEEE International Solid-State Circuits Conference (ISSCC), 100-101, 2017
1162017
A 1.25 ps Resolution 8b Cyclic TDC in 0.13m CMOS
YH Seo, JS Kim, HJ Park, JY Sim
IEEE Journal of Solid-State Circuits 47 (3), 736-743, 2011
1122011
A serpentine guard trace to reduce the far-end crosstalk voltage and the crosstalk induced timing jitter of parallel microstrip lines
K Lee, HB Lee, HK Jung, JY Sim, HJ Park
IEEE transactions on advanced packaging 31 (4), 809-817, 2008
1082008
A Global Model for the Identification of the Dominant Reactions for Atomic Oxygen in He/O2 Atmospheric‐Pressure Plasmas
GY Park, YJ Hong, HW Lee, JY Sim, JK Lee
Plasma Processes and Polymers 7 (3‐4), 281-287, 2010
1062010
Bimetallic nanocatalysts immobilized in nanoporous hydrogels for long‐term robust continuous glucose monitoring of smart contact lens
SK Kim, GH Lee, C Jeon, HH Han, SJ Kim, JW Mok, CK Joo, S Shin, ...
Advanced Materials 34 (18), 2110536, 2022
1052022
Toward sustainable output generation of liquid–solid contact triboelectric nanogenerators: The role of hierarchical structures
H Cho, J Chung, G Shin, JY Sim, DS Kim, S Lee, W Hwang
Nano energy 56, 56-64, 2019
1042019
12.6 A 160nW 63.9 fJ/conversion-step capacitance-to-digital converter for ultra-low-power wireless sensor nodes
H Ha, D Sylvester, D Blaauw, JY Sim
2014 IEEE International Solid-State Circuits Conference Digest of Technical …, 2014
1042014
5.7 A 29nW bandgap reference circuit
JM Lee, Y Ji, S Choi, YC Cho, SJ Jang, JS Choi, B Kim, HJ Park, JY Sim
2015 IEEE International Solid-State Circuits Conference-(ISSCC) Digest of …, 2015
1022015
A 300-MS/s, 1.76-ps-resolution, 10-b asynchronous pipelined time-to-digital converter with on-chip digital background calibration in 0.13-µm CMOS
JS Kim, YH Seo, Y Suh, HJ Park, JY Sim
IEEE Journal of Solid-State Circuits 48 (2), 516-526, 2012
812012
A 192-pW Voltage Reference Generating Bandgap– With Process and Temperature Dependence Compensation
Y Ji, J Lee, B Kim, HJ Park, JY Sim
IEEE Journal of Solid-State Circuits 54 (12), 3281-3291, 2019
752019
A 1.3 μW 0.6 V 8.7-ENOB successive approximation ADC in a 0.18 μm CMOS
SK Lee, SJ Park, Y Suh, HJ Park, JY Sim
2009 Symposium on VLSI Circuits, 242-243, 2009
742009
A 0.63 ps resolution, 11b pipeline TDC in 0.13 µm CMOS
YH Seo, JS Kim, HJ Park, JY Sim
2011 symposium on VLSI circuits-digest of technical papers, 152-153, 2011
712011
Serpentine microstrip lines with zero far-end crosstalk for parallel high-speed DRAM interfaces
K Lee, HK Jung, HJ Chi, HJ Kwon, JY Sim, HJ Park
IEEE Transactions on Advanced Packaging 33 (2), 552-558, 2009
662009
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