| High performance integrated circuit chip package I Turlik, A Reisman, D Nayak, LT Hwang, G Dishon, SL Jacobs, ... US Patent 5,325,265, 1994 | 175 | 1994 |
| Bonding structure for an electronic device LT Hwang, WH Lytle US Patent 5,912,510, 1999 | 66 | 1999 |
| Process for electrically connecting electrical devices using a conductive anisotropic material T Fang, LT Hwang, WM Williams US Patent 5,661,042, 1997 | 63 | 1997 |
| A review of the skin effect as applied to thin film interconnections LT Hwang, I Turlik IEEE transactions on components, hybrids, and manufacturing technology 15 (1 …, 1992 | 62 | 1992 |
| Apparatus for mounting a semiconductor chip and making electrical connections thereto A Reisman, CM Osburn, LT Hwang, J Narayan US Patent 4,774,630, 1988 | 59 | 1988 |
| A thermal module design for advanced packaging LT Hwang, I Turlik, A Reisman Journal of electronic materials 16, 347-355, 1987 | 59 | 1987 |
| Thermal stress analysis of a multichip package design R Darveaux, I Turlik, LT Hwang, A Reisman IEEE transactions on components, hybrids, and manufacturing technology 12 (4 …, 1989 | 57 | 1989 |
| Transmitarray design with enhanced aperture efficiency using small frequency selective surface cells and discrete Jones matrix analysis CY Hsu, LT Hwang, TS Horng, SM Wang, FS Chang, CN Dorny IEEE Transactions on Antennas and Propagation 66 (8), 3983-3994, 2018 | 46 | 2018 |
| A high-performance thermal module for computer packaging D Nayak, LT Hwang, I Turlik, A Reisman Journal of electronic materials 16, 357-364, 1987 | 46 | 1987 |
| A ZigBee position technique for indoor localization based on proximity learning CW Ou, CJ Chao, FS Chang, SM Wang, GX Liu, MR Wu, KY Cho, ... 2017 IEEE International Conference on Mechatronics and Automation (ICMA …, 2017 | 45 | 2017 |
| Passivation Schemes for Copper/Polymer Thin Film Interconnections Used in Multichip Modules GM Adema, LT Hwang, GA Rinne, I Turlik Electronic Components and Technology Conference, 776-782, 1992 | 45* | 1992 |
| Parameterized models for a RF chip-to-substrate interconnect I Doerr, LT Hwang, G Sommer, H Oppermann, L Li, M Petras, S Korf, ... 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat …, 2001 | 38 | 2001 |
| MIMO antenna design with built‐in decoupling mechanism for WLAN dual‐band applications SM Wang, LT Hwang, CJ Lee, CY Hsu, FS Chang Electronics Letters 51 (13), 966-968, 2015 | 35 | 2015 |
| Detection of vital signs for multiple subjects by using self-injection-locked radar and mutually injection-locked beam scanning array CY Hsu, CY Chuang, FK Wang, TS Horng, LT Hwang 2017 IEEE MTT-S International Microwave Symposium (IMS), 991-994, 2017 | 29 | 2017 |
| Effects of polymer/metal interaction in thin-film multichip module applications GM Adema, I Turlick, LT Hwang, GA Rinne, MJ Berry IEEE Transactions on Components, Hybrids, and Manufacturing Technology 13 (4 …, 1990 | 29 | 1990 |
| Embedded multilayer printed circuit LT Hwang, RB Lempkowski, L Li US Patent 7,136,274, 2006 | 27 | 2006 |
| Simulation and design of lossy transmission lines in a thin-film multichip package D Nayak, LT Hwang, I Turlik IEEE Transactions on Components, Hybrids, and Manufacturing Technology 13 (2 …, 1990 | 27 | 1990 |
| Embedded passives in organic substrate for bluetooth transceiver module L Li, P Bowles, LT Hwang, S Plager 53rd Electronic Components and Technology Conference, 2003. Proceedings …, 2003 | 25 | 2003 |
| Calculation of electrical parameters of a thin-film multichip package D Nayak, LT Hwang, I Turlik IEEE transactions on components, hybrids, and manufacturing technology 12 (2 …, 1989 | 22 | 1989 |
| Full chip-package-board co-design of broadband QFN bonding transition using backside via and defected ground structure YC Lin, WH Lee, TS Horng, LT Hwang IEEE transactions on components, packaging and manufacturing technology 4 (9 …, 2014 | 20 | 2014 |
Tzyy-Sheng HorngProf. of Electrical Engineering, National Sun Yat-Sen University, TaiwanVerified email at ee.nsysu.edu.tw