| Experimenting and modeling of catastrophic failure in electromigration-induced resistance degradation for deep submicron dual-damascene copper interconnects A Adhikari, A Roy Solid-State Electronics 148, 7-15, 2018 | 8 | 2018 |
| Theory and experiment on charging and discharging a capacitor through a reverse-biased diode A Roy, A Mallick, A Adhikari, P Guin, D Chatterjee American Journal of Physics 86 (6), 417-421, 2018 | 6 | 2018 |
| Microstructure measurement techniques for studying electromigration in ULSI interconnects A Roy, A Adhikari Critical Reviews in Solid State and Materials Sciences 41 (3), 159-191, 2016 | 5 | 2016 |
| Analysis, Estimation and Impact of Joule Heating in the Electromigration Test of Copper ULSI Interconnects A Adhikari, A Roy 2019 International Conference on Ubiquitous and Emerging Concepts on Sensors …, 2019 | 2 | 2019 |
| Inadequacy of Markov model in modeling of electromigration-induced resistance degradation A Adhikari, A Roy 2018 IEEE Electron Devices Kolkata Conference (EDKCON), 142-147, 2018 | 1 | 2018 |
| Atomic drift-less electromigration model for submicron copper interconnects A Roy, A Adhikari, CM Tan YMER, 2022 | | 2022 |
| Atomic drift-less electromigration model for submicron copper interconnects A Adhikari, A Roy, CM Tan | | |