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Co-authors
- Yang-Kyu ChoiProfessor of Electrical Engineering, KAISTVerified email at ee.kaist.ac.kr
- Hagyoul BaeJeonbuk National University, EEVerified email at jbnu.ac.kr
- Seunghyup YooProfessor, School of Electrical Engineering, KAIST, S. KoreaVerified email at kaist.edu
- Seungbum HongKorea Advanced Institute of Science and Technology (KAIST)Verified email at kaist.ac.kr
- Joon-Kyu HanAssistant Professor, Sogang UniversityVerified email at sogang.ac.kr
- Ji-Man, YuR&D Organization, SK HynixVerified email at nobelab.kaist.ac.kr
- Wukang KimIBMVerified email at ibm.com
- Jae HurIntel CorporationVerified email at intel.com
- Byung Chul JangKyungpook National Univeristy, Electronics EngineeringVerified email at knu.ac.kr
- Sung-Yool ChoiProfessor, School of Electrical Engineering, Graphene & 2D Materials Research Center, KAISTVerified email at kaist.ac.kr
- Kyu-Man HwangSemiconductor R&D Center, Samsung ElectronicsVerified email at nobelab.kaist.ac.kr
- Seung-Bae JeonAssistant Professor of Electronic Engineering, Hanbat National UniversityVerified email at hanbat.ac.kr
- Dipti GuptaProfessor of Material Science and Engg., IIT BombayVerified email at iitb.ac.in
- Dong-Il MoonNASA Ames Research CenterVerified email at nasa.gov
- Hoyeon KimThe Pennsylvania State UniversityVerified email at psu.edu
- Donggeon HanUC BerkeleyVerified email at berkeley.edu
- Changhun YunSchool of Polymer Science and Engineering, Chonnam National University, South KoreaVerified email at jnu.ac.kr
- Hanul MoonDong-A University, KoreaVerified email at dau.ac.kr