| Damascene copper electroplating for chip interconnections PC Andricacos, C Uzoh, JO Dukovic, J Horkans, H Deligianni IBM Journal of Research and Development 42 (5), 567-574, 1998 | 1750 | 1998 |
| A High Efficiency Electrodeposited Cu2ZnSnS4 Solar Cell S Ahmed, KB Reuter, O Gunawan, L Guo, LT Romankiw, H Deligianni Advanced Energy Materials 2 (2), 253-259, 2012 | 676 | 2012 |
| The chemistry of additives in damascene copper plating PM Vereecken, RA Binstead, H Deligianni, PC Andricacos IBM Journal of Research and Development 49 (1), 3-18, 2005 | 592 | 2005 |
| Enabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs) AW Topol, DC La Tulipe, L Shi, SM Alam, DJ Frank, SE Steen, J Vichiconti, ... IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest …, 2005 | 377 | 2005 |
| Electrodeposited Cu2ZnSnSe4 thin film solar cell with 7% power conversion efficiency L Guo, Y Zhu, O Gunawan, T Gokmen, VR Deline, S Ahmed, ... Progress in Photovoltaics: Research and Applications 22 (1), 58-68, 2014 | 198 | 2014 |
| Vertical nanowire FET devices H Deligianni, Q Huang, LT Romankiw US Patent 8,637,849, 2014 | 191 | 2014 |
| Methods of manufacture of vertical nanowire FET devices H Deligianni, Q Huang, LT Romankiw US Patent 7,892,956, 2011 | 147 | 2011 |
| Flip-chip interconnections using lead-free solders PC Andricacos, M Datta, H Deligianni, WJ Horkans, SK Kang, ... US Patent 6,224,690, 2001 | 124 | 2001 |
| In situ surface pH measurement during electrolysis using a rotating pH electrode H Deligianni, LT Romankiw IBM Journal of Research and Development 37 (2), 85-95, 1993 | 117 | 1993 |
| Effect of fluid flow on convective transport in small cavities RC Alkire, H Deligianni, JB Ju Journal of the Electrochemical Society 137 (3), 818, 1990 | 106 | 1990 |
| Selective capping of copper wiring PC Andricacos, ST Chen, JM Cotte, H Deligianni, M Krishnan, WT Tseng, ... US Patent 7,008,871, 2006 | 104 | 2006 |
| Role of oxygen vacancies in V/sub FB//V/sub t/stability of pFET metals on HfO/sub 2 E Cartier, FR McFeely, V Narayanan, P Jamison, BP Linder, M Copel, ... Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005., 230-231, 2005 | 104 | 2005 |
| Methods for fabricating silicon carriers with conductive through-vias with low stress and low defect density VS Basker, JM Cotte, H Deligianni, JU Knickerbocker, KT Kwietniak US Patent 7,863,189, 2011 | 101 | 2011 |
| Electrochemical fabrication of mechanically robust PbSn C4 interconnections M Datta, RV Shenoy, C Jahnes, PC Andricacos, J Horkans, JO Dukovic, ... Journal of the Electrochemical Society 142 (11), 3779, 1995 | 81 | 1995 |
| Copper alloys for chip and package interconnections PC Andricacos, H Deligianni, JME Harper, CK Hu, DJ Pearson, ... US Patent 6,063,506, 2000 | 80 | 2000 |
| The next frontier: electrodeposition for solar cell fabrication H Deligianni, S Ahmed, LT Romankiw The Electrochemical Society Interface 20 (2), 47, 2011 | 79 | 2011 |
| Deep filled vias P Andricacos, EI Cooper, TJ Dalton, H Deligianni, D Guidotti, ... US Patent 7,060,624, 2006 | 74 | 2006 |
| The role of mass transport on anisotropic electrochemical pattern etching R Alkire, H Deligianni Journal of the Electrochemical Society 135 (5), 1093, 1988 | 74 | 1988 |
| Method of making electroplated interconnection structures on integrated circuit chips PC Andricacos, H Deligianni, JO Dukovic, DC Edelstein, WJ Horkans, ... US Patent 6,709,562, 2004 | 71 | 2004 |
| MEMS RF switch with low actuation voltage H Deligianni, R Groves, C Jahnes, JL Lund, P Andricacos, J Cotte, ... US Patent 6,639,488, 2003 | 68 | 2003 |
Philippe M. VereeckenFellow/Professor imec/KULeuvenVerified email at imec.be
