| Investigation of thermal management materials for automotive electronic control units S Mallik, N Ekere, C Best, R Bhatti Applied Thermal Engineering 31 (2-3), 355-362, 2011 | 251 | 2011 |
| Computer simulation of random packing of unequal particles D He, NN Ekere, L Cai Physical review E 60 (6), 7098, 1999 | 243 | 1999 |
| A review of interconnection technologies for improved crystalline silicon solar cell photovoltaic module assembly MT Zarmai, NN Ekere, CF Oduoza, EH Amalu Applied energy 154, 173-182, 2015 | 193 | 2015 |
| A review of photovoltaic module technologies for increased performance in tropical climate OO Ogbomo, EH Amalu, NN Ekere, PO Olagbegi Renewable and Sustainable Energy Reviews 75, 1225-1238, 2017 | 178 | 2017 |
| Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges KC Otiaba, NN Ekere, RS Bhatti, S Mallik, MO Alam, EH Amalu Microelectronics Reliability 51 (12), 2031-2043, 2011 | 166 | 2011 |
| Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes R Durairaj, S Ramesh, S Mallik, A Seman, N Ekere Materials & Design 30 (9), 3812-3818, 2009 | 127 | 2009 |
| Effect of particle size ratio on the conducting percolation threshold of granular conductive–insulating composites D He, NN Ekere Journal of Physics D: Applied Physics 37 (13), 1848, 2004 | 110 | 2004 |
| Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions JA Depiver, S Mallik, EH Amalu Engineering Failure Analysis 125, 105447, 2021 | 91 | 2021 |
| Effect of operating temperature on degradation of solder joints in crystalline silicon photovoltaic modules for improved reliability in hot climates OO Ogbomo, EH Amalu, NN Ekere, PO Olagbegi Solar Energy 170, 682-693, 2018 | 91 | 2018 |
| High temperature reliability of lead-free solder joints in a flip chip assembly EH Amalu, NN Ekere Journal of Materials Processing Technology 212 (2), 471-483, 2012 | 89 | 2012 |
| Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach KC Otiaba, RS Bhatti, NN Ekere, S Mallik, M Ekpu Engineering Failure Analysis 28, 192-207, 2013 | 79 | 2013 |
| Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly R Durairaj, S Mallik, A Seman, A Marks, NN Ekere Journal of materials processing technology 209 (8), 3923-3930, 2009 | 75 | 2009 |
| Reflow profile study of the Sn‐Ag‐Cu solder B Salam, C Virseda, H Da, NN Ekere, R Durairaj Soldering & Surface Mount Technology 16 (1), 27-34, 2004 | 71 | 2004 |
| Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections MT Zarmai, NN Ekere, CF Oduoza, EH Amalu Robotics and Computer-Integrated Manufacturing 47, 37-43, 2017 | 70 | 2017 |
| A review of technology, materials and R&D challenges of upper limb prosthesis for improved user suitability R Brack, EH Amalu Journal of orthopaedics 23, 88-96, 2021 | 69 | 2021 |
| Modelling evaluation of Garofalo-Arrhenius creep relation for lead-free solder joints in surface mount electronic component assemblies EH Amalu, NN Ekere Journal of Manufacturing Systems 39, 9-23, 2016 | 68 | 2016 |
| Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device KC Otiaba, RS Bhatti, NN Ekere, S Mallik, MO Alam, EH Amalu, M Ekpu Microelectronics Reliability 52 (7), 1409-1419, 2012 | 68 | 2012 |
| Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material KC Otiaba, MI Okereke, RS Bhatti Applied Thermal Engineering 64 (1-2), 51-63, 2014 | 66 | 2014 |
| Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process EH Amalu, NN Ekere, S Mallik Materials & Design 32 (6), 3189-3197, 2011 | 65 | 2011 |
| Study of the interface microstructure of Sn-Ag-Cu lead-free solders and the effect of solder volume on intermetallic layer formation B Salam, NN Ekere, D Rajkumar 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat …, 2001 | 62 | 2001 |
![Dr Emeka Amalu [BEng (Hons), MEng, PhD, PG Cert HE, CEng, MIMechE, MIET, FHEA]](/scholar/images/cleardot.gif)
Dr Emeka Amalu [BEng (Hons), MEng,...Associate Professor of Mechanical Engineering, Teesside University, Middlesbrough, UKVerified email at tees.ac.uk