| Improved plasma resistance for porous low-k dielectrics by pore stuffing approach L Zhang, JF de Marneffe, MH Heyne, S Naumov, Y Sun, A Zotovich, ... ECS Journal of Solid State Science and Technology 4 (1), N3098, 2014 | 32 | 2014 |
| Vacuum ultra-violet damage and damage mitigation for plasma processing of highly porous organosilicate glass dielectrics JF De Marneffe, L Zhang, M Heyne, M Lukaszewicz, SB Porter, F Vajda, ... Journal of Applied Physics 118 (13), 2015 | 23 | 2015 |
| Multi-photon and electron impact ionisation studies of reactivity in adenine–water clusters B Barc, M Ryszka, JC Poully, EJ Al Maalouf, Z El Otell, J Tabet, R Parajuli, ... International Journal of Mass Spectrometry 365, 194-199, 2014 | 20 | 2014 |
| Comparison of vacuum ultra-violet emission of Ar/CF4 and Ar/CF3I capacitively coupled plasmas A Zotovich, O Proshina, Z El Otell, D Lopaev, T Rakhimova, A Rakhimov, ... Plasma Sources Science and Technology 25 (5), 055001, 2016 | 19 | 2016 |
| Vacuum ultra-violet emission of CF4 and CF3I containing plasmas and Their effect on low-k materials Z El Otell, V Šamara, A Zotovich, T Hansen, JF de Marneffe, MR Baklanov Journal of Physics D: Applied Physics 48 (39), 395202, 2015 | 18 | 2015 |
| Extraction and neutralization of positive and negative ions from a pulsed electronegative inductively coupled plasma D Marinov, Z El Otell, MD Bowden, NSJ Braithwaite Plasma Sources Science and Technology 24 (6), 065008, 2015 | 17 | 2015 |
| Impact of sequential infiltration synthesis on pattern fidelity of DSA lines A Singh, W Knaepen, S Sayan, Z El Otell, BT Chan, JW Maes, R Gronheid Advances in Patterning Materials and Processes XXXII 9425, 178-184, 2015 | 17 | 2015 |
| Tailored molecular glass resists for scanning probe lithography C Neuber, HW Schmidt, P Strohriegl, A Ringk, T Kolb, A Schedl, ... Advances in Patterning Materials and Processes XXXII 9425, 117-123, 2015 | 11 | 2015 |
| Pattern Roughness Mitigation of 22 nm Lines and Spaces: The Impact of a H2 Plasma Treatment P De Schepper, A Vaglio Pret, Z El Otell, T Hansen, ... Plasma Processes and Polymers 12 (2), 153-161, 2015 | 9 | 2015 |
| High-throughput process chain for single electron transistor devices based on field-emission scanning probe lithography and Smart Nanoimprint lithography technology C Lenk, Y Krivoshapkina, M Hofmann, S Lenk, T Ivanov, IW Rangelow, ... Journal of Vacuum Science & Technology B 37 (2), 2019 | 8 | 2019 |
| Spin-on-carbon hard masks utilising fullerene derivatives AG Brown, A Frommhold, T Lada, J Bowen, Z El Otell, APG Robinson Advances in Patterning Materials and Processes XXXIII 9779, 348-355, 2016 | 6 | 2016 |
| Line edge and width roughness smoothing by plasma treatment PD Schepper, T Hansen, E Altamirano-Sanchez, AV Pret, Z el Otell, ... J. Micro/Nanolith. MEMS MOEMS. 13 (2), 023006, 2014 | 6 | 2014 |
| Use of a thermally degradable chemical vapor deposited polymer film for low damage plasma processing of highly porous dielectrics JF Marneffe, T Yamaguchi, M Fujikawa, A Rezvanov, R Chanson, J Zhang, ... ACS Applied Electronic Materials 1 (12), 2602-2611, 2019 | 4 | 2019 |
| Hydrogen plasma treatment: the evolution of roughness in frequency domain P De Schepper, AV Pret, E Altamirano-Sánchez, Z El Otell, S De Gendt Advanced Etch Technology for Nanopatterning III 9054, 55-62, 2014 | 3 | 2014 |
| Advanced Etching for Nano-devices and 2D materials JF de Marneffe, M Cooke, A Goodyear, NSJ Braithwaite, Y Sutton, ... Proceedings of the 42nd International Conference on Micro and Nano …, 2016 | 2 | 2016 |
| The Influence of H2 Plasma Treatment on LWR Mitigation: The Importance of EUV Photoresist Composition P De Schepper, Z El Otell, A Vaglio Pret, E Altamirano‐Sanchez, ... Plasma Processes and Polymers 12 (7), 624-641, 2015 | 2 | 2015 |
| H2 plasma and neutral beam treatment of EUV photoresist P De Schepper, D Marinov, Z el Otell, E Altamirano-Sánchez, ... Advanced Etch Technology for Nanopatterning IV 9428, 39-46, 2015 | 2 | 2015 |
| In-situ monitoring of etch uniformity using plasma emission interferometry V Samara, JF de Marneffe, Z el Otell, DJ Economou Journal of Vacuum Science & Technology B 33 (3), 2015 | 1 | 2015 |
| Molecular glass resist performance for nano-pattern transfer Z El Otell, A Ringk, T Kolb, C Neuber, L Hansel, JF de Marneffe Advanced Etch Technology for Nanopatterning IV 9428, 100-106, 2015 | 1 | 2015 |
| Chemical etch nonvolatile materials for mram patterning W Yang, T Mukherjee, Z Zhu, SSH Tan, R Lin, Y Pan, Z El Otell, ... US Patent App. 17/622,167, 2022 | | 2022 |
Jean-Francois de MarneffePrincipal Member of Technical Staff at imec vzwVerified email at imec.be