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Ihor Radchenko
Ihor Radchenko
Xi'an Jiaotong University, Center for Advancing Materials Performance from the Nanoscale (CAMP-Nano)
Verified email at mymail.sutd.edu.sg
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Cited by
Year
From cells to laminate: Probing and modeling residual stress evolution in thin silicon photovoltaic modules using synchrotron X‐ray micro‐diffraction experiments and finite …
SK Tippabhotla, I Radchenko, WJR Song, G Illya, V Handara, M Kunz, ...
Progress in Photovoltaics: research and applications 25 (9), 791-809, 2017
632017
Effects of interface shear strength during failure of semicoherent metal–metal nanolaminates: An example of accumulative roll-bonded Cu/Nb
I Radchenko, HP Anwarali, SK Tippabhotla, AS Budiman
Acta Materialia 156, 125-135, 2018
552018
Probing phase transformations and microstructural evolutions at the small scales: Synchrotron X-ray microdiffraction for advanced applications in 3D IC (integrated circuits …
I Radchenko, SK Tippabhotla, N Tamura, AS Budiman
Journal of Electronic Materials 45, 6222-6232, 2016
492016
Probing stress and fracture mechanism in encapsulated thin silicon solar cells by synchrotron X-ray microdiffraction
VA Handara, I Radchenko, SK Tippabhotla, KR Narayanan, G Illya, ...
Solar Energy Materials and Solar Cells 162, 30-40, 2017
462017
Synchrotron X-ray micro-diffraction–Probing stress state in encapsulated thin silicon solar cells
SK Tippabhotla, I Radchenko, KN Rengarajan, G Illya, V Handara, ...
Procedia Engineering 139, 123-133, 2016
372016
The roles of interfaces and other microstructural features in Cu/Nb nanolayers as revealed by in situ beam bending experiments inside an scanning electron microscope (SEM)
HPA Ali, I Radchenko, N Li, A Budiman
Materials Science and Engineering: A 738, 253-263, 2018
342018
Tailoring electronic properties of multilayer phosphorene by siliconization
OI Malyi, KV Sopiha, I Radchenko, P Wu, C Persson
Physical Chemistry Chemical Physics 20 (3), 2075-2083, 2018
302018
Effect of multilayer interface through in situ fracture of Cu/Nb and Al/Nb metallic multilayers
HPA Ali, I Radchenko, N Li, A Budiman
Journal of Materials Research 34 (9), 1564-1573, 2019
172019
Probing Stress States in Silicon Nanowires During Electrochemical Lithiation Using In Situ Synchrotron X-Ray Microdiffraction
I Ali, SK Tippabhotla, I Radchenko, A Al-Obeidi, CV Stan, N Tamura, ...
Frontiers in Energy Research 6, 19, 2018
162018
Additive Manufacturing Enabled by Electrospinning for Tougher Bio‐Inspired Materials
K Agarwal, Y Zhou, HP Anwar Ali, I Radchenko, A Baji, AS Budiman
Advances in Materials Science and Engineering 2018 (1), 8460751, 2018
142018
Low stress encapsulants? Influence of encapsulation materials on stress and fracture of thin silicon solar cells as revealed by synchrotron X-ray submicron diffraction
KN Rengarajan, I Radchenko, G Illya, V Handara, M Kunz, N Tamura, ...
Procedia Engineering 139, 76-86, 2016
142016
Interface-mediated plasticity and fracture in nanoscale Cu/Nb multilayers as revealed by in situ clamped microbeam bending
AS Budiman, R Sahay, HPA Ali, SK Tippabhotla, I Radchenko, ...
Materials Science and Engineering: A 803, 140705, 2021
122021
Stress evolution in silicon nanowires during electrochemical lithiation using in situ synchrotron X-ray microdiffraction
SK Tippabhotla, I Radchenko, CV Stan, N Tamura, AS Budiman
Journal of Materials Research 34 (9), 1622-1631, 2019
102019
Designing novel multilayered nanocomposites for high-performance coating materials with online strain monitoring capability
HP Anwar Ali, I Radchenko, J Zhou, L Qing, A Budiman
Proceedings of the Institution of Mechanical Engineers, Part L: Journal of …, 2019
82019
Enabling the study of stress states using in situ µSXRD in the silicon nanowire anode during electrochemical lithiation in a specially designed Li-ion battery test cell
SK Tippabhotla, I Radchenko, CV Stan, N Tamura, AS Budiman
Procedia engineering 215, 263-275, 2017
72017
Effect of interconnect plasticity on soldering induced residual stress in thin crystalline silicon solar cells
SK Tippabhotla, I Radchenko, W Song, N Tamura, AAO Tay, AS Budiman
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 734-737, 2016
72016
Measuring the Pull-Off Force of an Individual Fiber Using a Novel Picoindenter/Scanning Electron Microscope Technique
R Sahay, I Radchenko, AS Budiman, A Baji
Materials 10 (9), 1074, 2017
32017
Understanding size effects in the advanced through-silicon via interconnect schemes for 3D ICs
I Ali, I Radchenko, SK Tippabhotla, SWM Ridhuan, AAO Tay, N Tamura, ...
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 748-751, 2016
12016
Shear loading of FCC/BCC Cu/Nb nanolaminates studied by in situ X-ray micro-diffraction
E Navarro, TW Cornelius, H Proudhon, R Sahay, I Radchenko, ...
Microelectronic Engineering 276, 111999, 2023
2023
Modeling crystallographic anisotropy in interfacial sliding phenomenon in nanoindentation of nanoscale Cu/Nb accumulated rolling bonding (ARB) multilayered materials
AS Budiman, R Sahay, FE Gunawan, C Harito, H Gunawan, I Radchenko, ...
AIP Conference Proceedings 2594 (1), 2023
2023
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