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Feng XU
Feng XU
Unknown affiliation
Verified email at ustc.edu.cn
Title
Cited by
Cited by
Year
Comparison of image quality in computed laminography and tomography
F Xu, L Helfen, T Baumbach, H Suhonen
Optics Express 20 (2), 794-806, 2012
1072012
Ductile crack initiation and propagation assessed via in situ synchrotron radiation-computed laminography
TF Morgeneyer, L Helfen, I Sinclair, H Proudhon, F Xu, T Baumbach
Scripta Materialia 65 (11), 1010-1013, 2011
732011
Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling
YW Chang, Y Cheng, F Xu, L Helfen, T Tian, M Di Michiel, C Chen, KN Tu, ...
Acta Materialia 117, 100-110, 2016
702016
Three-dimensional pelvis and limb anatomy of the Cenomanian hind-limbed snake Eupodophis descouensi (Squamata, Ophidia) revealed by synchrotron …
A Houssaye, F Xu, L Helfen, V De Buffrénil, T Baumbach, P Tafforeau
Journal of Vertebrate Paleontology 31 (1), 2-7, 2011
642011
In situ observations of fractures in short carbon fiber/epoxy composites
X Hu, L Wang, F Xu, T Xiao, Z Zhang
Carbon 67, 368-376, 2014
572014
Synchrotron radiation computed laminography for polymer composite failure studies
F Xu, L Helfen, AJ Moffat, G Johnson, I Sinclair, T Baumbach
Journal of synchrotron radiation 17 (2), 222-226, 2010
562010
Predictive value of EphA2 and EphrinA-1 expression in oesophageal squamous cell carcinoma
F Xu, W Zhong, J Li, Z Shanshen, J Cui, JM Nesland, Z Suo
Anticancer research 25 (4), 2943-2950, 2005
522005
Quantitative characterization of deformation and damage process by digital volume correlation: A review
F Xu
Theoretical and Applied Mechanics Letters 8 (2), 83-96, 2018
502018
Electromigration mechanism of failure in flip-chip solder joints based on discrete void formation
YW Chang, Y Cheng, L Helfen, F Xu, T Tian, M Scheel, M Di Michiel, ...
Scientific reports 7 (1), 17950, 2017
492017
In situ investigation of metal's microwave sintering
F Xu, Y Li, X Hu, Y Niu, J Zhao, Z Zhang
Materials Letters 67 (1), 162-164, 2012
472012
In situ investigation on the mixed-interaction mechanisms in the metal–ceramic system’s microwave sintering
YC Li, F Xu, XF Hu, D Kang, TQ Xiao, XP Wu
Acta materialia 66, 293-301, 2014
432014
Synchrotron and neutron laminography for three-dimensional imaging of devices and flat material specimens
L Helfen, TF Morgeneyer, F Xu, MN Mavrogordato, I Sinclair, B Schillinger, ...
International journal of materials research 103 (2), 170-173, 2012
412012
In situ investigation of ceramic sintering by synchrotron radiation X-ray computed tomography
F Xu, XF Hu, H Miao, JH Zhao
Optics and lasers in engineering 48 (11), 1082-1088, 2010
392010
Real internal microstructure based key mechanism analysis on the micro-damage process of short fibre-reinforced composites
X Hu, J Fang, F Xu, B Dong, Y Xiao, L Wang
Scientific reports 6 (1), 34761, 2016
372016
Correlative nanoscale 3D imaging of structure and composition in extended objects
F Xu, L Helfen, H Suhonen, D Elgrabli, S Bayat, P Reischig, T Baumbach, ...
PLoS One 7 (11), e50124, 2012
362012
Stimuli dependent impedance of conductive magnetorheological elastomers
Y Wang, S Xuan, B Dong, F Xu, X Gong
Smart Materials and Structures 25 (2), 025003, 2015
322015
Laminographic imaging using synchrotron radiation–challenges and opportunities
L Helfen, F Xu, H Suhonen, P Cloetens, T Baumbach
Journal of Physics: Conference Series 425 (19), 192025, 2013
312013
Neutron laminography—a novel approach to three-dimensional imaging of flat objects with neutrons
L Helfen, F Xu, B Schillinger, E Calzada, I Zanette, T Weitkamp, ...
Nuclear Instruments and Methods in Physics Research Section A: Accelerators …, 2011
292011
Discussion on Microwave-Matter Interaction Mechanisms by In Situ Observation of “Core-Shell” Microstructure during Microwave Sintering
W Liu, F Xu, Y Li, X Hu, B Dong, Y Xiao
Materials 9 (3), 120, 2016
272016
Rapid diagnosis of electromigration induced failure time of Pb-free flip chip solder joints by high resolution synchrotron radiation laminography
T Tian, F Xu, J Kyu Han, D Choi, Y Cheng, L Helfen, M Di Michiel, ...
Applied Physics Letters 99 (8), 2011
272011
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