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Co-authors
M. SathishPrincipal Scientist, CSIR-Central Electrochemical Research Institute (CSIR-CECRI), Karaikudi, IndiaVerified email at cecri.res.in- Dr. Karnan ManickavasakamPost-Doctoral Fellow, Chulalongkorn University, Bangkok, ThailandVerified email at chula.ac.th
- Venkata Prasad ChowdamPostdoctoral Researcher, Intelligent Mechatronics Engineering,Sejong University, Seoul, South KoreaVerified email at sejong.ac.kr
- You Seung RimAssociate Professor, Department of Semiconductor Systems Engineering, Sejong UniversityVerified email at sejong.ac.kr
- Tan Hoang Vu NguyenPh.D ScholarVerified email at sju.ac.kr
- Won Jin SongSejong UniversityVerified email at sju.ac.kr
- Dr. Subramani KaipannanPostdoctoral Fellow, Norwegian University of Science and TechnologyVerified email at ntnu.no
- Megala MoorthyDoctoral StudentVerified email at jnu.ac.kr
- Saranyan VijayaraghavanCSIR-CECRIVerified email at cecri.res.in
- Mohan RameshScientist, Microsystem Packaging Group, CSIR-Central Electronics Engineering Research InstituteVerified email at ceeri.res.in
- Sinsu KyoungPowercubesemi, Inc.Verified email at powercubesemi.com
- Nouredine SengougaUniversité de BiskraVerified email at univ-biskra.dz
