| 3D system integration on 300 mm wafer level: High-aspect-ratio TSVs with ruthenium seed layer by thermal ALD and subsequent copper electroplating S Killge, I Bartusseck, M Junige, V Neumann, J Reif, C Wenzel, ... Microelectronic Engineering 205, 20-25, 2019 | 21 | 2019 |
| Demonstration of a graphene-base heterojunction transistor with saturated output current C Strobel, CA Chavarin, B Leszczynska, S Leszczynski, F Winkler, ... Journal of Applied Physics 125 (23), 2019 | 12 | 2019 |
| Characterisation of Cu/Cu bonding using self-assembled monolayer M Lykova, I Panchenko, U Künzelmann, J Reif, M Geidel, MJ Wolf, ... Soldering & Surface Mount Technology 30 (2), 106-111, 2018 | 12 | 2018 |
| In vacuo studies on plasma-enhanced atomic layer deposition of cobalt thin films J Reif, M Knaut, S Killge, F Winkler, M Albert, JW Bartha Journal of Vacuum Science & Technology A 38 (1), 2020 | 11 | 2020 |
| Novel Graphene Adjustable-Barrier Transistor with Ultra-High Current Gain C Strobel, CA Chavarin, K Richter, M Knaut, J Reif, S Völkel, A Jahn, ... ACS Applied Materials & Interfaces 14 (34), 39249-39254, 2022 | 7 | 2022 |
| Ti: sapphire based lidar systems JP Wolf, J Kolenda, P Rairoux, J Reif, M Douard, M Ulbricht Laser in der Umweltmeßtechnik/Laser in Remote Sensing: Vorträge des 11 …, 1994 | 6 | 1994 |
| Calibration procedures of lidar systems M Ulbricht, P Rairoux, J Reif, D Weidauer, JP Wolf Optical Sensing in Environmental Monitoring 2112, 194-197, 1993 | 6 | 1993 |
| In situ studies on atomic layer etching of aluminum oxide using sequential reactions with trimethylaluminum and hydrogen fluoride J Reif, M Knaut, S Killge, M Albert, T Mikolajick, JW Bartha Journal of Vacuum Science & Technology A 40 (3), 2022 | 5 | 2022 |
| Influences on Plasmon Resonance Linewidth in Metal− Insulator− Metal Structures Obtained via Colloidal Self-Assembly Y Yu, D Schletz, J Reif, F Winkler, M Albert, A Fery, R Kirchner ACS Applied Materials & Interfaces 12 (50), 56281-56289, 2020 | 5 | 2020 |
| In vacuo investigations on the nucleation of TaCN by plasma enhanced atomic layer deposition J Reif, M Knaut, S Killge, M Albert, JW Bartha Microelectronic Engineering 211, 13-17, 2019 | 3 | 2019 |
| Dry release of MEMS origami using thin Al2O3 films for facet-based device integration J Zhang, J Reif, C Strobel, P Chava, A Erbe, A Voigt, T Mikolajick, ... Micro and Nano Engineering 19, 100179, 2023 | 2 | 2023 |
| Improved graphene-base heterojunction transistor with different collector semiconductors for high-frequency applications C Strobel, C Chavarin, S Leszczynski, K Richter, M Knaut, J Reif, S Völkel, ... Advanced Materials Letters 13 (1), 2201-1688, 2022 | 2 | 2022 |
| Hole selective nickel oxide as transparent conductive oxide D Tröger, J Reif, T Mikolajick, M Grube Journal of Vacuum Science & Technology A 40 (1), 2022 | 2 | 2022 |
| Direct plasma-enhanced atomic layer deposition of aluminum nitride for water permeation barriers DD Fischer, M Knaut, J Reif, F Nehm, M Albert, JW Bartha Journal of Vacuum Science & Technology A 38 (2), 2020 | 2 | 2020 |
| Towards Full-area Passivating Contacts for Silicon Surfaces based on Al2O3-TiOxDouble Layers D Tröger, M Grube, M Knaut, J Reif, JW Bartha, T Mikolajick 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion (WCPEC)(A …, 2018 | 2 | 2018 |
| Cu passivation with self-assembled monolayers for direct metal bonding in 3D integration M Lykova, I Panchenko, M Geidel, J Reif, JM Wolf, KD Lang 2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017 | 2 | 2017 |
| Comparison of three titanium-precursors for atomic-layer-deposited TiO2 for passivating contacts on silicon D Hiller, F Munnik, J López-Vidrier, D Solonenko, J Reif, M Knaut, ... Journal of Vacuum Science & Technology A 42 (3), 2024 | 1 | 2024 |
| 3D system integration on 300 mm wafer level S Kilige, I Bartusseck, M Junige, V Neumann, J Reif, C Wenzel, ... | | 2019 |
| Towards Full-area Passivating Contacts for Silicon Surfaces based on Al₂O₃-TiOₓ Double Layers D Tröger, M Grube, M Knaut, J Reif, JW Bartha, T Mikolajick | | 2018 |
| PEALD and pulsed CVD of Cobalt thin films using the precursor cyclopentadienylcobalt dicarbonyl C Hossbach, S Shukla, D Fischer, J Reif, S Bönhardt, M Geidel, M Albert, ... | | 2017 |
