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- John A. RogersSimpson/Querrey Professor, Northwestern UniversityVerified email at northwestern.edu
- Roozbeh GhaffariNorthwestern University, Center for Bio-Integrated ElectronicsVerified email at northwestern.edu
- Jungil ChoiDept. of Mechanical Engineering, Ajou UniversityVerified email at ajou.ac.kr
- Tomoyuki YokotaUniversity of TokyoVerified email at ntech.t.u-tokyo.ac.jp
- Walter VoitUniversity of Texas at DallasVerified email at utdallas.edu
- Tsuyoshi Sekitani, Ph.D, ProfessorThe Institute of Scientific and Industrial Research,Osaka UniversityVerified email at sanken.osaka-u.ac.jp
- Takao SomeyaProfessor, Department of Electric and Electronic Engineering, The University of TokyoVerified email at ee.t.u-tokyo.ac.jp
- Amay Jairaj BandodkarAssistant Professor at North Carolina State UniversityVerified email at ncsu.edu
- Philipp GutrufGutrufLab, Assoc. Prof. BME,2024 da Vinci Fellow, University of ArizonaVerified email at email.arizona.edu
- Siddharth KrishnanResearch Scientist, Massachusetts Institute of Technology, Boston Children's HospitalVerified email at mit.edu
- Martin KaltenbrunnerSoft Matter Physics and LIT Soft Materials Lab, Johannes Kepler University LinzVerified email at jku.at
- Yonggang HuangWalter P. Murphy Professor of M.E., C.E.E. and M.S.E., Northwestern UniversityVerified email at northwestern.edu
- Taylor WareAssociate Professor, Biomedical Engineering, Materials Science and Engineering, Texas A&M UniversityVerified email at tamu.edu
- Yeguang XueApple Inc.Verified email at apple.com
- Siegfried BauerFIEEE, Professor of Soft Matter Physics, Johannes Kepler University Linz, AustriaVerified email at jku.at
- Zhigang Suo (锁志刚)Harvard Princeton UCSBVerified email at seas.harvard.edu