| Fabrication of nanomaterials using porous alumina templates S Shingubara Journal of Nanoparticle Research 5, 17-30, 2003 | 552 | 2003 |
| Synthesis of vertical high‐density epitaxial Si (100) nanowire arrays on a Si (100) substrate using an anodic aluminum oxide template T Shimizu, T Xie, J Nishikawa, S Shingubara, S Senz, U Gösele Advanced Materials 19 (7), 917-920, 2007 | 233 | 2007 |
| Ordered two-dimensional nanowire array formation using self-organized nanoholes of anodically oxidized aluminum S Shingubara, O Okino, Y Sayama, HSH Sakaue, TTT Takahagi Japanese journal of applied physics 36 (12S), 7791, 1997 | 207 | 1997 |
| Self-organization of a porous alumina nanohole array using a sulfuric/oxalic acid mixture as electrolyte S Shingubara, K Morimoto, H Sakaue, T Takahagi Electrochemical and solid-state letters 7 (3), E15, 2004 | 148 | 2004 |
| Bottom-up fill of copper in deep submicrometer holes by electroless plating S Shingubara, Z Wang, O Yaegashi, R Obata, H Sakaue, T Takahagi Electrochemical and Solid-State Letters 7 (6), C78, 2004 | 135 | 2004 |
| Electromigration in a single crystalline submicron width aluminum interconnection S Shingubara, Y Nakasaki, H Kaneko Applied physics letters 58 (1), 42-44, 1991 | 126 | 1991 |
| Two-dimensional nanowire array formation on Si substrate using self-organized nanoholes of anodically oxidized aluminum S Shingubara, O Okino, Y Sayama, H Sakaue, T Takahagi Solid-State Electronics 43 (6), 1143-1146, 1999 | 124 | 1999 |
| Bottom-up fill for submicrometer copper via holes of ULSIs by electroless plating Z Wang, O Yaegashi, H Sakaue, T Takahagi, S Shingubara Journal of the Electrochemical society 151 (12), C781, 2004 | 111 | 2004 |
| Experimental conditions for a highly ordered monolayer of gold nanoparticles fabricated by the Langmuir–Blodgett method S Huang, G Tsutsui, H Sakaue, S Shingubara, T Takahagi Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2001 | 98 | 2001 |
| Directional copper deposition using dc magnetron self-sputtering ZJ Radzimski, WM Posadowski, SM Rossnagel, S Shingubara Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 1998 | 93 | 1998 |
| Well-size-controlled colloidal gold nanoparticles dispersed in organic solvents GTG Tsutsui, SHS Huang, HSH Sakaue, SSS Shingubara, TTT Takahagi Japanese Journal of Applied Physics 40 (1R), 346, 2001 | 85 | 2001 |
| Electromigration‐induced abrupt changes in electrical resistance associated with void dynamics in aluminum interconnections S Shingubara, H Kaneko, M Saitoh Journal of applied physics 69 (1), 207-212, 1991 | 85 | 1991 |
| Effects of the surface pressure on the formation of Langmuir− Blodgett monolayer of nanoparticles S Huang, K Minami, H Sakaue, S Shingubara, T Takahagi Langmuir 20 (6), 2274-2276, 2004 | 83 | 2004 |
| Fabrication of nanohole array on Si using self-organized porous alumina mask S Shingubara, O Okino, Y Murakami, H Sakaue, T Takahagi Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2001 | 81 | 2001 |
| Formation of aluminum nanodot array by combination of nanoindentation and anodic oxidation of aluminum S Shingubara, Y Murakami, K Morimoto, T Takahagi Surface Science 532, 317-323, 2003 | 78 | 2003 |
| Cu2ZnSnS4 thin films and nanowires prepared by different single-step electrodeposition method in quaternary electrolyte M Jeon, T Shimizu, S Shingubara Materials Letters 65 (15-16), 2364-2367, 2011 | 76 | 2011 |
| Electroless plating of copper on metal-nitride diffusion barriers initiated by displacement plating Z Wang, T Ida, H Sakaue, S Shingubara, T Takahagi Electrochemical and solid-state letters 6 (3), C38, 2003 | 74 | 2003 |
| Adhesion improvement of electroless copper to a polyimide film substrate by combining surface microroughening and imide ring cleavage Z Wang, A Furuya, K Yasuda, H Ikeda, T Baba, M Hagiwara, S Toki, ... Journal of adhesion science and technology 16 (8), 1027-1040, 2002 | 73 | 2002 |
| Suppression of native oxide growth in sputtered TaN films and its application to Cu electroless plating Z Wang, O Yaegashi, H Sakaue, T Takahagi, S Shingubara Journal of Applied Physics 94 (7), 4697-4701, 2003 | 71 | 2003 |
| Formation of electroless barrier and seed layers in a high aspect ratio through-Si vias using Au nanoparticle catalyst for all-wet Cu filling technology F Inoue, T Shimizu, T Yokoyama, H Miyake, K Kondo, T Saito, T Hayashi, ... Electrochimica Acta 56 (17), 6245-6250, 2011 | 69 | 2011 |