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Co-authors
- Cheol Seong HwangProfessor, Department of Materials Science and Engineering, Seoul National UniversityVerified email at snu.ac.kr
- Gun Hwan KimAssociate Professor, Yonsei UniversityVerified email at yonsei.ac.kr
- Byung Joon ChoiSeoul National University of Science and TechnologyVerified email at seoultech.ac.kr
- Jung Ho YoonAssistant Professor at Sungkyunkwan UniversityVerified email at skku.edu
- Min Hwan LeeAssociate Professor, Department of Mechanical Engineering, University of California, MercedVerified email at ucmerced.edu
- Hanchan SongDepartment of Electrical and Computer Engineering, Texas A&M UniversityVerified email at tamu.edu
- Kyung Jean YoonIntel Santa ClaraVerified email at intel.com
- Doo Seok JeongHanyang UniversityVerified email at hanyang.ac.kr
- Yong Cheol ShinVerified email at mit.edu
- Seong Keun KimKorea Institute of Science and TechnologyVerified email at kist.re.kr
- J. Joshua YangUniversity of Southern California, Professor ECE, IEEE Fellow / NAI FellowVerified email at usc.edu
- Jae Bum JeonDepartment of Materials Science and Engineering, KAISTVerified email at kaist.ac.kr
- R. Stanley WilliamsTexas A & M University ECE DepartmentVerified email at rstanleywilliams.com
- Geunyoung KimKAIST, MSEVerified email at kaist.ac.kr
- Sungho KimEwha Womans UniversityVerified email at ewha.ac.kr
- Jae Hyuck JangKorea Basic Science InstituteVerified email at kbsi.re.kr
- Deok-Hwang KwonKorea Institute of Science and TechnologyVerified email at kist.re.kr
- Hakseung RheeDepartment of Materials Science and Engineering, KAISTVerified email at kaist.ac.kr
- Gwangmin KimDepartment of Materials Science and Engineering, KAISTVerified email at alumni.kaist.ac.kr
- m kimDepartment of Materials Science and Engineering, Seoul National UniversityVerified email at snu.ac.kr