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| Zero thermal expansion in YbGaGe due to an electronic valence transition JR Salvador, F Guo, T Hogan, MG Kanatzidis Nature 425 (6959), 702-705, 2003 | 254 | 2003 |
| Metal recovery from waste printed circuit boards: A review for current status and perspectives J Hao, Y Wang, Y Wu, F Guo Resources, Conservation and Recycling 157, 104787, 2020 | 201 | 2020 |
| Composite lead-free electronic solders KN Subramanian, F Guo Lead-Free Electronic Solders: A Special Issue of the Journal of Materials …, 2007 | 165 | 2007 |
| Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder Y Shi, J Tian, H Hao, Z Xia, Y Lei, F Guo Journal of Alloys and Compounds 453 (1-2), 180-184, 2008 | 164 | 2008 |
| Effects of trace amounts of rare earth additions on microstructure and properties of Sn-Bi-based solder alloy W Dong, Y Shi, Z Xia, Y Lei, F Guo Journal of Electronic Materials 37, 982-991, 2008 | 161 | 2008 |
| Processing and aging characteristics of eutectic Sn-3.5 Ag solder reinforced with mechanically incorporated Ni particles F Guo, J Lee, S Choi, JP Lucas, TR Bieler, KN Subramanian Journal of Electronic Materials 30, 1073-1082, 2001 | 137 | 2001 |
| Creep behavior in Cu and Ag particle-reinforced composite and eutectic Sn-3.5 Ag and Sn-4.0 Ag-0.5 Cu non-composite solder joints F Guo, JP Lucas, KN Subramanian Journal of Materials Science: Materials in Electronics 12, 27-35, 2001 | 128 | 2001 |
| Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint B Li, Y Shi, Y Lei, F Guo, Z Xia, B Zong Journal of Electronic Materials 34, 217-224, 2005 | 106 | 2005 |
| Microstructural characterisation of reflowed and isothermally‐aged Cu and Ag particulate reinforced Sn‐3.5 Ag composite solders F Guo, S Choi, JP Lucas, KN Subramanian Soldering & surface mount technology 13 (1), 7-18, 2001 | 106 | 2001 |
| Evaluation of creep behavior of near-eutectic Sn–Ag solders containing small amount of alloy additions F Guo, S Choi, KN Subramanian, TR Bieler, JP Lucas, A Achari, ... Materials Science and Engineering: A 351 (1-2), 190-199, 2003 | 105 | 2003 |
| Creep properties of Sn-Ag solder joints containing intermetallic particles S Choi, JG Lee, F Guo, TR Bieler, KN Subramanian, JP Lucas JOM 53, 22-26, 2001 | 95 | 2001 |
| Effects of reflow on wettability, microstructure and mechanical properties in lead-free solders F Guo, S Choi, JP Lucas, KN Subramanian Journal of electronic materials 29, 1241-1248, 2000 | 84 | 2000 |
| Processing and creep properties of Sn-Cu composite solders with small amounts of nanosized Ag reinforcement additions F Tai, F Guo, ZD Xia, YP Lei, YF Yan, JP Liu, YW Shi Journal of electronic materials 34, 1357-1362, 2005 | 82 | 2005 |
| Mechanical properties of intermetallic compounds associated with Pb-free solder joints using nanoindentation JP Lucas, H Rhee, F Guo, KN Subramanian Journal of electronic Materials 32, 1375-1383, 2003 | 79 | 2003 |
| Investigation of rare earth-doped BiAg high-temperature solders Y Shi, W Fang, Z Xia, Y Lei, F Guo, X Li Journal of Materials Science: Materials in Electronics 21, 875-881, 2010 | 77 | 2010 |
| Effect of isothermal aging and thermal cycling on interfacial IMC growth and fracture behavior of SnAgCu/Cu joints X Li, F Li, F Guo, Y Shi Journal of electronic materials 40, 51-61, 2011 | 71 | 2011 |
| Creep property of composite solders reinforced by nano-sized particles Y Shi, J Liu, Z Xia, Y Lei, F Guo, X Li Journal of Materials Science: Materials in Electronics 19, 349-356, 2008 | 69 | 2008 |
| Creep properties of composite solders reinforced with nano-and microsized particles Y Shi, J Liu, Y Yan, Z Xia, Y Lei, F Guo, X Li Journal of electronic materials 37, 507-514, 2008 | 67 | 2008 |
| Effect of rare earth on mechanical creep–fatigue property of SnAgCu solder joint WM Xiao, YW Shi, GC Xu, R Ren, F Guo, ZD Xia, YP Lei Journal of alloys and compounds 472 (1-2), 198-202, 2009 | 66 | 2009 |
