| Verilog-A modeling of organic electrochemical transistors P Sideris, S Siskos, G Malliaras 2017 6th International Conference on Modern Circuits and Systems …, 2017 | 10 | 2017 |
| Inter-tier dynamic coupling and RF crosstalk in 3D sequential integration P Sideris, J Lugo-Alvarez, P Batude, L Brunet, P Acosta-Alba, S Kerdiles, ... 2019 IEEE International Electron Devices Meeting (IEDM), 3.4. 1-3.4. 4, 2019 | 8 | 2019 |
| RF Performance of Devices Processed in Low-Temperature Sequential Integration TM Frutuoso, P Sideris, J Lugo-Alvarez, X Garros, L Brunet, ... IEEE Transactions on Electron Devices 68 (7), 3157-3162, 2021 | 7 | 2021 |
| Impact of Inter-Tier Coupling on Static and Noise Performance in 3D Sequential Integration Technology P Sideris, L Brunet, G Sicard, P Batude, C Theodorou 2019 Joint International EUROSOI Workshop and International Conference on …, 2019 | 4 | 2019 |
| 3D sequential integration: applications and associated key enabling modules (design & technology) P Batude, O Billoint, S Thuries, P Malinge, C Fenouillet-Beranger, ... 2021 IEEE International Electron Devices Meeting (IEDM), 3.2. 1-3.2. 4, 2021 | 3 | 2021 |
| Parasitic Coupling in 3D Sequential Integration: The Example of a Two-Layer 3D Pixel P Sideris, A Peizerat, P Batude, G Sicard, C Theodorou Technologies 10 (2), 38, 2022 | 2 | 2022 |
| Inter-tier electrostatic coupling effects in 3D sequential integration devices and circuits P Sideris, L Brunet, L Ciampolini, G Sicard, P Batude, C Theodorou Solid-State Electronics 168, 107715, 2020 | 2 | 2020 |
| Opportunities and challenges brought by 3D-sequential integration P Batude, L Brunet, C Fenouillet-Beranger, D Lattard, F Andrieu, M Vinet, ... 2021 IEEE International Interconnect Technology Conference (IITC), 1-1, 2021 | 1 | 2021 |
| Verilog-A Modelling of Organic Electrochemical Transistors and Read-out Instrumentation P Sideris | 1* | |
| Inter-tier Coupling Analysis in Back-illuminated Monolithic 3DSI Image Sensor Pixels P Sideris, A Peizerat, P Batude, C Theodorou, G Sicard 2021 10th International Conference on Modern Circuits and Systems …, 2021 | | 2021 |
| Impact of noise and electromagnetic coupling in sequential 3D technologies: study, modeling and impact on circuit performance P Sideris Université Grenoble Alpes [2020-....], 2021 | | 2021 |
| Impact de bruit et couplages électro magnétiques dans les technologies 3D séquentielles: Etudes, modélisation et parade P Sideris Université Grenoble Alpes, 2021 | | 2021 |
Christoforos THEODOROUIMEP-LAHC, Minatec, Grenoble INPVerified email at minatec.inpg.fr
