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Carla Borja Espinosa
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Hard superconducting gap in germanium
A Tosato, V Levajac, JY Wang, CJ Boor, F Borsoi, M Botifoll, CN Borja, ...
Communications Materials 4 (1), 23, 2023
332023
Sub-nanometer mapping of strain-induced band structure variations in planar nanowire core-shell heterostructures
S Martí-Sánchez, M Botifoll, E Oksenberg, C Koch, C Borja, MC Spadaro, ...
Nature communications 13 (1), 4089, 2022
142022
Emergence of floquet edge states in the coupled su–schrieffer–heeger model
C Borja, E Gutiérrez, A López
Journal of Physics: Condensed Matter 34 (20), 205701, 2022
72022
Conductance quantization in atomic-sized gold contacts using a low-cost mechanically controllable break junction setup
C Borja, C Sabater, C Untiedt, E Medina, W Brämer-Escamilla
European Journal of Physics 41 (6), 065401, 2020
32020
Signature of adsorbed solvents for molecular electronics revealed via scanning tunneling microscopy
T de Ara, C Sabater, C Borja-Espinosa, P Ferrer-Alcaraz, BC Baciu, ...
Materials Chemistry and Physics 291, 126645, 2022
12022
Supplementary Information: Hard superconducting gap in germanium
A Tosato, V Levajac, JY Wang, CJ Boor, F Borsoi, M Botifoll, C Borja, ...
Nature Publishing Group, 2023
2023
Supplementary Information Sub-nanometer mapping of strain-induced band structure variations in planar nanowire core-shell heterostructures
S Martí-Sànchez, M Botifoll, E Oksenberg, C Koch, C Borja, MC Spadaro, ...
Springer Nature, 2022
2022
Data & analysis underlying the publication: Hard superconducting gap in a high-mobility semiconductor
A Tosato, V Levajac, JY Wang, CJ Boor, F Borsoi, M Botifoll, C Borja, ...
4TU. ResearchData, 2022
2022
Unveiling the Signature of Adsorbed Organic Solvents for Molecular Electronics through STM Approaches
T de Ara, C Sabater, C Borja-Espinosa, P Ferrer-Alcaraz, BC Baciu, ...
arXiv preprint arXiv:2203.02610, 2022
2022
Conductance measurements on atomic-sized contacts of gold using a low-cost mechanically controllable break junction equipment
B Espinosa, C Nataly
Universidad de Investigación de Tecnología Experimetal Yachay, 2020
2020
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Articles 1–10