| Integrated LC filter on silicon for DC–DC converter applications P Artillan, M Brunet, D Bourrier, JP Laur, N Mauran, L Bary, M Dilhan, ... IEEE Transactions on Power Electronics 26 (8), 2319-2325, 2010 | 61 | 2010 |
| Dynamic performance of maximum power point tracking circuits using sinusoidal extremum seeking control for photovoltaic generation R Leyva, P Artillan, C Cabal, B Estibals, C Alonso International Journal of Electronics 98 (4), 529-542, 2011 | 35 | 2011 |
| Effect of water content on microwave dielectric properties of building materials R Damez, P Artillan, AH de Menibus, C Bermond, P Xavier Construction and Building Materials 263, 120107, 2020 | 10 | 2020 |
| A PEEC approach for circular spiral inductive components modeling P Artillan, B Estibals, A Salles, J Abboud, P Aloisi, C Alonso 2007 IEEE International Symposium on Circuits and Systems (ISCAS), 301-304, 2007 | 10 | 2007 |
| A Closed-Form Expression for the Frequency-Dependent Microwave Responsivity of Transistors Based on the –TEXPRESERVE1 Curve and S-Parameters G Paz-Martínez, P Artillan, J Mateos, E Rochefeuille, T González, ... IEEE Transactions on Microwave Theory and Techniques, 2023 | 9 | 2023 |
| Electrical broadband characterization method of dielectric molding in 3-D IC and results T Lacrevaz, C Bermond, O El Bouayadi, G Houzet, P Artillan, Y Lamy, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (9 …, 2014 | 9 | 2014 |
| In-situ characterization up to 100 GHz of insulators used in new 3D “System in Package on board”(SiPoB) technologies G Houzet, T Lacrevaz, C Bermond, P Artillan, D Auchère, L Schwarz, ... Microelectronics Journal 108, 104990, 2021 | 8 | 2021 |
| 20 GHz antenna radiation pattern obtained from near-field mapping with electrooptic probe on a single plane G Gaborit, P Artillan, C Bermond, G Revillod, G Chevrier-Gros, ... IEEE Antennas and Wireless Propagation Letters 19 (7), 1177-1181, 2020 | 8 | 2020 |
| A new modeling approach for circular spiral inductors P Artillan, B Estibals, C Alonso 2007 European Conference on Power Electronics and Applications, 1-8, 2007 | 8 | 2007 |
| Wide Band Frequency Characterization of Al-Doped and Undoped Rutile TiO2 Thin Films for MIM Capacitors A Chaker, C Bermond, P Artillan, P Gonon, C Vallée, A Bsiesy IEEE Electron Device Letters 38 (3), 375-378, 2017 | 7 | 2017 |
| Through silicon capacitors (TSC) for noise reduction in power distribution network K Dieng, P Artillan, C Bermond, O Guiller, T Lacrevaz, S Joblot, G Houzet, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 247-253, 2015 | 7 | 2015 |
| Modeling and frequency performance analysis of through silicon capacitors in silicon interposers K Dieng, P Artillan, C Bermond, O Guiller, T Lacrevaz, S Joblot, G Houzet, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (4 …, 2017 | 6 | 2017 |
| Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer K Dieng, P Artillan, C Bermond, O Guiller, T Lacrevaz, S Joblot, G Houzet, ... 2014 International 3D Systems Integration Conference (3DIC), 1-8, 2014 | 6 | 2014 |
| Design, modelization and realization of integrated inductive components for low power supplies and microsystems P Artillan INSA de Toulouse, 2008 | 5* | 2008 |
| Fast and robust RF characterization method of insulators used in high speed interconnects networks T Lacrevaz, G Houzet, D Auchère, P Artillan, C Bermond, B Blampey, ... 2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI), 1-4, 2018 | 4 | 2018 |
| Electrical model of different architectures of through silicon capacitors for high frequency power distribution network (PDN) decoupling operations K Dieng, C Bermond, P Artillan, O Guiller, T Lacrevaz, S Joblot, G Houzet, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 74-81, 2016 | 4 | 2016 |
| 3D interconnect optimization for single channel 100-GBps transmission in a photonic interposer K Morot, A Farcy, T Lacrevaz, C Bermond, P Artillan, B Fléchet, ... 2017 IEEE 21st Workshop on Signal and Power Integrity (SPI), 1-4, 2017 | 3 | 2017 |
| A very fast computing and accurate formula for the mutual inductance of two circular wire loops P Artillan, B Estibals, G Montseny, C Alonso International Conference on Electrical Drives and Power Electronics (EDPE 2009), 2009 | 3 | 2009 |
| Current and voltage responsivity up to 110 GHz in GaN asymmetric nano-diodes I Íñiguez-de-la-Torre, E Pérez-Martín, P Artillan, E Rochefeuille, ... Applied Physics Letters 123 (12), 2023 | 2 | 2023 |
| Design of a High-Speed Ethernet Connector for Harsh Environments Y Boujmad, C Bermond, P Artillan, O Gavard, M Prudhom, F Khalili, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 2 | 2020 |
Ramon LeyvaUniversitat Rovira i Virgili (URV)Verified email at urv.cat
