| Thermal conductivity enhancement of coaxial carbon@ boron nitride nanotube arrays L Jing, MK Samani, B Liu, H Li, RY Tay, SH Tsang, O Cometto, ... ACS applied materials & interfaces 9 (17), 14555-14560, 2017 | 39 | 2017 |
| High porosity and light weight graphene foam heat sink and phase change material container for thermal management A Zehri, MK Samani, MG Latorre, A Nylander, T Nilsson, Y Fu, N Wang, ... Nanotechnology 31 (42), 424003, 2020 | 25 | 2020 |
| Effects of high temperature treatment of carbon nanotube arrays on graphite: increased crystallinity, anchoring and inter-tube bonding J Hansson, A Nylander, M Flygare, K Svensson, L Ye, T Nilsson, Y Fu, ... Nanotechnology 31 (45), 455708, 2020 | 20 | 2020 |
| Degradation of carbon nanotube array thermal interface materials through thermal aging: Effects of bonding, array height, and catalyst oxidation A Nylander, J Hansson, T Nilsson, L Ye, Y Fu, J Liu ACS Applied Materials & Interfaces 13 (26), 30992-31000, 2021 | 19 | 2021 |
| Embedded Fin‐Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors D Jiang, N Wang, M Edwards, W Mu, A Nylander, Y Fu, K Jeppson, J Liu Small 12 (11), 1521-1526, 2016 | 18 | 2016 |
| Reliability investigation of a carbon nanotube array thermal Interface material A Nylander, J Hansson, M Kabiri Samani, C Chandra Darmawan, ... Energies 12 (11), 2080, 2019 | 12 | 2019 |
| Bipolar electrochemical capacitors using double-sided carbon nanotubes on graphite electrodes J Hansson, Q Li, A Smith, I Zakaria, T Nilsson, A Nylander, L Ye, ... Journal of Power Sources 451, 227765, 2020 | 11 | 2020 |
| Covalent anchoring of carbon nanotube-based thermal interface materials using epoxy-silane monolayers A Nylander, Y Fu, M Huang, J Liu IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (3 …, 2018 | 8 | 2018 |
| Synthesis of a graphene carbon nanotube hybrid film by joule self-heating CVD for thermal applications J Hansson, MK Samani, A Nylander, L Ye, N Wang, T Nilsson, J Liu 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2450-2456, 2018 | 8 | 2018 |
| Graphene oxide and nitrogen-doped graphene coated copper nanoparticles in water-based nanofluids for thermal management in electronics A Zehri, A Nylander, TMJ Nilsson, L Ye, Y Fu, J Liu Journal of Nanofluids 11 (1), 125-134, 2022 | 6 | 2022 |
| Multiple growth of graphene from a pre-dissolved carbon source A Fazi, A Nylander, A Zehri, J Sun, P Malmberg, L Ye, J Liu, Y Fu Nanotechnology 31 (34), 345601, 2020 | 6 | 2020 |
| Experimentally verified, fast analytic and numerical design of superconducting resonators in flip-chip architectures HX Li, D Shiri, S Kosen, M Rommel, L Chayanun, A Nylander, ... IEEE Transactions on Quantum Engineering, 2023 | 5 | 2023 |
| Signal crosstalk in a flip-chip quantum processor S Kosen, HX Li, M Rommel, R Rehammar, M Caputo, L Grönberg, ... PRX Quantum 5 (3), 030350, 2024 | 4 | 2024 |
| Thermal reliability study of polymer bonded carbon nanotube array thermal interface materials A Nylander, CC Darmawan, AB Boyon, L Divay, MK Samani, MA Ras, ... 2018 24rd International Workshop on Thermal Investigations of ICs and …, 2018 | 4 | 2018 |
| Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications A Nylander, Y Fu, L Ye, J Liu 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 175-181, 2017 | 3 | 2017 |
| Characterization of process-related interfacial dielectric loss in aluminum-on-silicon by resonator microwave measurements, materials analysis, and imaging L Chayanun, J Biznárová, L Zeng, P Malmberg, A Nylander, A Osman, ... APL Quantum 1 (2), 2024 | 2 | 2024 |
| Fundamental Characterization of Low Dimensional Carbon Nanomaterials for 3D Electronics Packaging A Nylander PQDT-Global, 2021 | 2 | 2021 |
| Graphene-coated copper nanoparticles for thermal conductivity enhancement in water-based nanofluid AH Zehri, A Nylander, L Ye, J Liu 2019 22nd European Microelectronics and Packaging Conference & Exhibition …, 2019 | 2 | 2019 |
| Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader Y Liu, N Wang, L Ye, A Zehri, A Nylander, A Nkansah, H Lu, J Liu Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) 2019 (NOR …, 2019 | 2 | 2019 |
| Fabrication and characterisation of carbon nanotube array thermal interface materials A Nylander PQDT-Global, 2018 | 1 | 2018 |
Johan LiuProfessor, Chalmers University of TechnologyVerified email at chalmers.se